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1–2 jobs· newest first

PMTS Silicon Photonics Packaging Integration
GlobalFoundries · Essex Junction, US
$132K–$242KSenior
PMTS Silicon Photonics Packaging Integration
GlobalFoundries · Essex Junction, US
$132K–$242KSenior

+10K new in the last hour

PMTS Silicon Photonics Packaging Integration

GlobalFoundries · Posted Nov 9, 2026

Essex Junction, Vermont, United States
Senior
$132K–$242K per year
15+ years

Apply with RefersoAI Apply on careers page

Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms.

Compensation

$131,900.00 - $241,500.00

Responsibilities

Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules
Develop and implement scalable fiber-to-chip coupling strategies
Drive heterogeneous integration of photonic and electronic components using 2.5D/3D/3.5D packaging technologies
Perform multiphysics simulations to optimize package performance and reliability
Lead root cause analysis and corrective actions for yield and reliability issues

Requirements

Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field
Nice to have: automated optical/electro-optical test setups
Nice to have: motion control systems
Nice to have: co-packaged optics (CPO)
Nice to have: pluggable modules

Skills

fiber attach photonic alignment optical coupling die attach flip-chip underfill molding micro-optics integration reliability standards qualification methodologies FMEA DOE FA tools multiphysics simulations thermal modeling mechanical modeling optical simulation tools Lumerical COMSOL Python-based test setups Python

See full job description

PMTS Silicon Photonics Packaging Integration

GlobalFoundries · Posted Nov 9, 2026

Essex Junction, Vermont, United States
Senior
$132K–$242K per year
15+ years

Apply with RefersoAI Apply on careers page

Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms.

Compensation

$131,900.00 - $241,500.00

Responsibilities

Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules
Develop and implement scalable fiber-to-chip coupling strategies
Drive heterogeneous integration of photonic and electronic components using 2.5D/3D/3.5D packaging technologies
Perform multiphysics simulations to optimize package performance and reliability
Lead root cause analysis and corrective actions for yield and reliability issues

Requirements

Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field
Nice to have: automated optical/electro‑optical test setups
Nice to have: motion control systems
Nice to have: co‑packaged optics (CPO)
Nice to have: pluggable modules

Skills

fiber attach processes photonic alignment optical coupling techniques

micro‑optics integration

thermal simulation

mechanical simulation

optical simulation

Python-based test setups

See full job description