Lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. Collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures.
$131,900.00 - $241,500.00
- Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
- Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.
- Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).
- Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.
- Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
- Master’s degree or higher in Packaging
- Materials Science
- Mechanical Engineering
- Nice to have: Python
- Nice to have: automated optical/electro-optical test setups
Principal Manufacturing Engineer (PCBA)NewImpulse Space · Redondo Beach, US