- Hillsboro, Oregon, United States
- On-site
- Full-time
- $134K–$189K per year
- 4+ years
Support the development of next-generation semiconductor packaging technologies, focusing on 3D IC and advanced manufacturing processes.
Compensation
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
Responsibilities
- Develop, evaluate, and optimize semiconductor manufacturing processes supporting next-generation 3D IC and advanced packaging technologies.
- Support technology development initiatives focused on introducing new processes and manufacturing capabilities for future technology generations.
- Conduct process characterization, experimental evaluations, and data analysis to identify opportunities for process improvement.
- Apply statistical process control (SPC), design of experiments (DOE), and engineering analysis techniques to evaluate process performance and support technology development.
- Troubleshoot manufacturing process and equipment challenges, perform root cause analysis, and implement corrective actions to improve process performance.
Requirements
- Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field with 4+ years of experience in semiconductor manufacturing, process development, or equipment development.
- Master's degree in the same fields with 3+ years of experience in semiconductor manufacturing, process development, or equipment development.