Referso Jobs

Principal Manufacturing Engineer (PCBA)

Impulse Space · Posted Nov 10, 2026

Open

Redondo Beach, California, United States
Full-time · Principal
$200K–$230K per year
10+ years

Principal Manufacturing Engineer (PCBA)

Impulse Space · Posted Nov 10, 2026

Open

Redondo Beach, California, United States
Full-time · Principal
$200K–$230K per year
10+ years

PMTS Silicon Photonics Packaging Integration

GlobalFoundries · Posted Nov 9, 2026

Open

Essex Junction, Vermont, United States
Senior
$132K–$242K per year
15+ years

Apply with RefersoAI Apply on careers page

Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms.

Compensation

$131,900.00 - $241,500.00

Responsibilities

Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules
Develop and implement scalable fiber-to-chip coupling strategies
Drive heterogeneous integration of photonic and electronic components using 2.5D/3D/3.5D packaging technologies
Perform multiphysics simulations to optimize package performance and reliability
Lead root cause analysis and corrective actions for yield and reliability issues

Requirements

Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field
Nice to have: automated optical/electro-optical test setups
Nice to have: motion control systems
Nice to have: co-packaged optics (CPO)
Nice to have: pluggable modules

Skills

fiber attach photonic alignment optical coupling die attach

PMTS Silicon Photonics Packaging Integration

GlobalFoundries · Posted Nov 9, 2026

Open

Essex Junction, Vermont, United States
Senior
$132K–$242K per year
15+ years

Apply with RefersoAI Apply on careers page

Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms.

Compensation

$131,900.00 - $241,500.00

Responsibilities

Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules
Develop and implement scalable fiber-to-chip coupling strategies
Drive heterogeneous integration of photonic and electronic components using 2.5D/3D/3.5D packaging technologies
Perform multiphysics simulations to optimize package performance and reliability
Lead root cause analysis and corrective actions for yield and reliability issues

Requirements

Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field
Nice to have: automated optical/electro‑optical test setups
Nice to have: motion control systems
Nice to have: co‑packaged optics (CPO)
Nice to have: pluggable modules

Skills

fiber attach processes photonic alignment optical coupling techniques

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