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半導体後工程量産技術者

Renesas Electronics · Posted Nov 11, 2026

Takasaki, Japan

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Responsible for FCBGA/WLCSP post‑process manufacturing, including yield, quality, cost improvement, defect handling, and coordination with overseas vendors.

Responsibilities

Develop and validate post‑process techniques for FCBGA/WLCSP
Improve yield, quality, and cost during production
Handle defect investigations and root‑cause analysis
Coordinate with overseas vendors for process support

Requirements

Nice to have: Experience with FCBGA package yield improvement
Nice to have: Experience with WLCSP yield improvement
Nice to have: Experience with overseas vendor coordination

Skills

Semiconductor post‑process FCBGA WLCSP Yield improvement Quality improvement Cost improvement Defect handling Vendor coordination

See full job description

Semiconductor Assembly Mass Production Engineer

Semiconductor Assembly Mass Production Engineer

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半導体後工程量産技術者

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WLCSP jobs

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Responsibilities

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