- Fort Collins, Colorado, United States
- $110K–$176K per year
- 8+ years
Lead the full‑flow failure analysis lifecycle for advanced silicon and packaging technologies at Broadcom.
Compensation
The annual base salary range for this position is USD 109,700.00 To USD 175,500.00
Responsibilities
- Own full‑flow FA on advanced‑node logic and mixed‑signal devices and advanced packages
- Plan and execute individual FA plans through background data collection, ATE datalog interpretation, and non‑destructive analysis
- Apply fault isolation techniques to localize defects in front‑side and backside configurations
- Perform nanoprobing for BEOL and FEOL electrical characterization and defect isolation
- Execute sample preparation and physical analysis including mechanical, chemical, PFIB, backside thinning, cross‑section SEM/TEM, elemental analysis (EDS)
Requirements
- BS in Electrical Engineering
- MS in Electrical Engineering
- PhD in Electrical Engineering
- BS in Materials Science
- MS in Materials Science