- Goleta, California, United States
- On-site
- Full-time
- $150K–$217K per year
- 5–5 years
Design, build, and test electronics packaging for quantum processors and related cryogenic hardware.
Compensation
US: $150000 - $217000 (USD) + 15% bonus target + equity + benefits
Responsibilities
- Collaborate with adjacent teams to mature design, assembly, test, and managing workflows for new electronics packages and test setups.
- Define mechanical requirements for quantum packages and other critical component and system interfaces.
- Drive detail designs to support research and development (R&D) and production electronics packaging.
- Write and execute test plans to fully verify designs prior to deployment.
- Optimize prototype designs for production at scale.
Requirements
- Bachelor's degree in Mechanical Engineering
- Bachelor's degree in Product Design
- Bachelor's degree in Electrical Engineering
- Bachelor's degree in a related field
- Nice to have: Master's or PhD degree in Mechanical Engineering