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1–2 jobs· newest first

SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)New
GlobalFoundries · Singapore, Singapore
Full-time · Senior
SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)New
GlobalFoundries · Singapore, Singapore

+10K new in the last hour

SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

GlobalFoundries · Posted Nov 12, 2026

Singapore, Singapore
Full-time · Senior
10+ years

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Lead the Advanced Packaging Program focusing on 2.5D and 3D heterogeneous integration technologies, overseeing integration activities, providing technical guidance, and driving process development.

Responsibilities

Oversee and manage the integration of 2.5D and 3D heterogeneous integration technologies
Provide technical guidance and expertise in 2.5D and 3D packaging processes, materials, and equipment
Develop and maintain project plans, timelines, and budgets
Drive the development and optimization of 2.5D and 3D heterogeneous integration processes
Implement and monitor quality control measures

Requirements

Bachelor’s or master’s degree in electrical engineering, Materials Science, Mechanical Engineering, or a related field
Nice to have: semiconductor packaging

Skills

2.5D heterogeneous integration 3D heterogeneous integration Interposer design TSVs Die stacking System-in-package (SiP)Project Management

Benefits

Equal opportunity employment

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SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

GlobalFoundries · Posted Nov 12, 2026

Singapore, Singapore
10+ years

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Lead integration activities for 2.5D and 3D heterogeneous integration technologies within GlobalFoundries’ Advanced Packaging Program.

Responsibilities

Oversee and manage integration of 2.5D and 3D heterogeneous integration technologies
Provide technical guidance in packaging processes, materials, and equipment
Develop and maintain project plans, timelines, and budgets
Drive development and optimization of integration processes
Implement and monitor quality control measures

Requirements

Bachelor’s or master’s degree in electrical engineering, Materials Science, Mechanical Engineering, or a related field

Skills

2.5D and 3D heterogeneous integration technologies interposer design through-silicon vias (TSVs)die stacking system-in-package (SiP)project management problem solving

technical documentation

See full job description