- Essex Junction, Vermont, United States
- Senior
- $132K–$242K per year
- 15+ years
Lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
Compensation
Expected Salary Range $131,900.00 - $241,500.00
Responsibilities
- Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
- Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.
- Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).
- Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.
- Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
Requirements
- Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.
- Nice to have: automated optical/electro-optical test setups
- Nice to have: motion control systems
- Nice to have: co-packaged optics (CPO)
- Nice to have: silicon photonics ecosystems