- Essex Junction, Vermont, United States
- Senior
- $132K–$242K per year
- 15+ years
Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms.
Compensation
$131,900.00 - $241,500.00
Responsibilities
- Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules
- Develop and implement scalable fiber-to-chip coupling strategies
- Drive heterogeneous integration of photonic and electronic components using 2.5D/3D/3.5D packaging technologies
- Perform multiphysics simulations to optimize package performance and reliability
- Lead root cause analysis and corrective actions for yield and reliability issues
Requirements
- Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field
- Nice to have: automated optical/electro-optical test setups
- Nice to have: motion control systems
- Nice to have: co-packaged optics
- Nice to have: pluggable modules