Contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout.
Compensation
The starting salary range posted for this position is $155,000.00 to $222,600.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits.
Responsibilities
Contribute to package design activities including planning, floor planning, pinout optimization, stack‑up definition, and high‑speed routing support.
Collaborate with SI/PI, silicon floor planning, layout, and manufacturing teams to ensure high‑quality package solutions.
Support package implementation activities and work closely with layout editors to ensure alignment between design intent and physical implementation.
Participate in technical investigations, design reviews, and tradeoff discussions involving performance, manufacturability, and schedule considerations.
Assist in developing and improving package design methodologies, flows, and best practices.
Requirements
Bachelor’s with 5+ years of experience or Master’s degree with 3+ years of experience in Electrical Engineering or a related field.
Lead power architecture for multi-die SoC systems, defining rail plans, voltage domains, and power delivery across compute chiplets, I/O dies, memory interfaces, and package.
Responsibilities
Define system power architecture and allocate power budgets
Own rail plan and voltage domains
Work with package and platform teams on voltage regulation
Specify power-on, ramp, boot, reset, shutdown, idle-entry, and fault-recovery flows
Architect power-management control and communication across dies
Requirements
Bachelor’s degree in electrical engineering, computer engineering, power electronics, or related field
The Feeder/Folder continuously grasps, sorts and grades clean textiles and then either folds by hand or feeds into an ironer or folding machine for final finishing.
Compensation
Hourly Base Pay: $19.15
Responsibilities
Grasp textiles from a cart/bin then sort, inspect and grade according to quality standards.
Fold, assemble and package by hand different types and sizes of textiles.
Feed different types and sizes of textiles into ironers or folding machines.
Place finished product onto conveyors or into carts, dump slings of product onto work tables.
Move loaded or empty carts/bins within the production area.
Assist department manager in achieving sales and profit goals while maintaining a safe, clean environment and delivering excellent customer service in the produce department.
Responsibilities
Create an outstanding customer experience through exceptional service
Establish and maintain a safe and clean environment
Assist the department manager in reaching sales and profit goals
Monitor all established quality assurance standards
Embrace the Customer 1st strategy
Requirements
Nice to have: Comparable Retail experience
Nice to have: Second language (speaking, reading and/or writing)
Inspects, labels and packages raw and finished products. May be required to maintain records according to Good Manufacturing Practices. May be working in a clean-room environment. Moderate supervision is required.
Compensation
Pay Rate: $20–$21.50/hr on W2
Responsibilities
Inspects, labels and packages raw and finished products
Maintains records according to Good Manufacturing Practices
Lead the development and lifecycle support of custom integrated circuits for advanced radar products.
Compensation
The expected annual salary range for this role is $164,594—$246,788 USD
Responsibilities
Own the long-term manufacturability, production continuity, and sustaining support of Echodyne’s existing ASIC(s).
Lead the technical evaluation, qualification, and controlled release of foundry, process-node, package, assembly, test, and material changes, and resolve associated yield, reliability, quality, and obsolescence risks.
Collaborate with Electrical Engineering, RF Engineering, and other technical stakeholders to translate product and system needs into ASIC requirements and architectures.
Lead ASIC-level functional partitioning and trade studies involving power, performance, area, process technology, intellectual property, packaging, test strategy, and make-versus-buy decisions.
Lead ASIC development from specification through production release, including analog, digital, and mixed-signal design; design verification; physical implementation and sign-off; design for test; tape-out; silicon bring-up; characterization; qualification; and production ramp.
Requirements
BS in Electrical Engineering, Computer Engineering, or a related technical field
Nice to have: Experience developing ASICs for radar, sensing, aerospace, defense, autonomous systems
Nice to have: Experience assuming technical ownership of an externally developed ASIC or transferring ASIC design knowledge and data between organizations
Nice to have: Direct design experience across both analog or mixed-signal and digital IC domains
Nice to have: Experience contributing to the establishment of new ASIC development flows, design environments, and external-partner operating models
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