- Pasadena, California, United States
- On-site
- $123K–$160K per year
- 2+ years
Fabrication backend engineer supporting quantum computing device packaging and process development at AWS Center for Quantum Computing.
Compensation
USA, CA, Pasadena - 122,600.00 - 160,000.00 USD annually
Responsibilities
- Partner closely with other teams to integrate new backend modules into devices
- Lead the sustainment and development of packaging process including dicing, wirebonding, flip chip bonding and device characterization
- Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues
- Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability
- Analyze process data to identify trends, improve stability, and drive continuous yield improvement
Requirements
- Bachelor's degree in mechanical engineering, electrical engineering, material science, physics or equivalent
- Nice to have: microfabrication
- Nice to have: characterization
- Nice to have: microscope
- Nice to have: shear test