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1–2 jobs· newest first

Lab Technician (III)New
Pride Global · Sunnyvale, US+1 more
$36–$41Hybrid · Contract
Fabrication Backend Engineer, AWS CQC - Fabrication
Amazon · Pasadena, US
$123K–$160KOn-site

+10K new in the last hour

P

Lab Technician (III)

Pride Global · Posted Nov 9, 2026

Sunnyvale, California, United States +1 more
Hybrid
Contract
$36–$41 per hour
2+ years

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Electronics team technician responsible for assembly, testing, and support of mechanical and electrical devices.

Locations (2)

Sunnyvale, California, United States
Goleta, California, United States

Compensation

Pay Range: $36/hr to $41/hr on W2

Responsibilities

Assemble and configure electronics (soldering, wirebonding, and mechanical assembly), fridge wiring configuration, and networking test equipment.
Testing of assembled electrical and mechanical devices to validate proper assembly.
Gather data using testing procedures designed by electronics team engineers.
Support deployment and operation of technologies developed by the electronics team that serves the greater organization.
Help maintain organization/operation of lab test equipment and materials including inventory.

Requirements

Associate or higher degree in engineering, technology, or related fields
Nice to have: vector network analyzers
Nice to have: spectrum analyzers
Nice to have: oscilloscopes
Nice to have: EM theory

Skills

electronics technician soldering wirebonding mechanical assembly electrical measurements electronics assembly techniques UNIX command-line interfaces data analysis troubleshooting schematic reading multimeter power supplies calipers UNIX google sheets

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Fabrication Backend Engineer, AWS CQC - Fabrication

Amazon · Posted Nov 5, 2026

Pasadena, California, United States
On-site
$123K–$160K per year
2+ years

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Fabrication backend engineer supporting quantum computing device packaging and process development at AWS Center for Quantum Computing.

Compensation

USA, CA, Pasadena - 122,600.00 - 160,000.00 USD annually

Responsibilities

Partner closely with other teams to integrate new backend modules into devices
Lead the sustainment and development of packaging process including dicing, wirebonding, flip chip bonding and device characterization
Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues
Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability
Analyze process data to identify trends, improve stability, and drive continuous yield improvement

Requirements

Bachelor's degree in mechanical engineering, electrical engineering, material science, physics or equivalent
Nice to have: microfabrication
Nice to have: characterization
Nice to have: microscope
Nice to have: shear test

Skills

dicing wirebonding flip chip bonding

electrical probing

device packaging

process engineering

statistics process control

failure analysis

IC packaging equipment

Benefits

health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage)
401(k) matching
paid time off
parental leave

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