- Ottawa, Ontario, Canada
- 8+ years
Lead the end-to-end thermal design, simulation, optimization, and physical validation of Direct-to-Chip liquid cooling solutions for next-generation AI accelerators and high-density compute platforms.
Compensation
The annual base salary range for this position is USD To USD
Responsibilities
- Build and run detailed CFD and thermal-resistance network models
- Research advanced cooling technologies and develop integration and test plans
- Co-design high-performance liquid cold plates
- Specify, select, and qualify thermal interface materials
- Design coolant flow paths and related mechanisms
Requirements
- Bachelor’s or Master’s degree in Mechanical or Thermal Engineering (M.S. preferred)