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1–3 jobs· newest first

Advanced Packaging & Integration EngineerNew
Cisco · San Jose, US
$155K–$225K
2027 Spring Process Engineer Co-op - Doctorate (Gloucester, MA)
Applied Materials · Gloucester, US
$47–$50On-site · Internship
2027 Spring Process Engineer Co-op - Doctorate (Gloucester, MA)
Applied Materials · Gloucester, US
$47–$50On-site · Internship · Intern

+10K new in the last hour

Advanced Packaging & Integration Engineer

Cisco · Posted Nov 9, 2026

San Jose, California, United States
$155K–$225K per year
4+ years

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Advanced packaging technology development engineer focused on silicon photonic packaging and electronic-photonic integration.

Compensation

The starting salary range posted for this position is $154,900.00 to $225,300.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits.

Responsibilities

Drive definition, design and analysis of packaging technology test vehicles
Drive validation of new technology against key performance metrics
Apply deep process expertise to oversee wafer processing, fine pitch bumping, D2W/W2W hybrid bonding, fanout, advanced substrate development, and assembly
Work with top-tier foundry and assembly partners to develop and qualify robust packaging solutions for high density photonics integration, CPO and on-board optics
Utilize design and modeling experience to guide Design for Manufacturability (DfM) and Design for Reliability (DfR)

Requirements

PhD or MS in Mechanical Engineering, Electrical Engineering, Physics, or a related field
Nice to have: physical failure analysis
Nice to have: hybrid bonding
Nice to have: thin die/wafer processing
Nice to have: finite element analysis

Skills

advanced packaging silicon photonic packaging electronic-photonic integration 2.5D/3D chip stacking heterogenous integration ultra-fine pitch interconnect technologies wafer processing fine pitch bumping D2W/W2W hybrid bonding fanout advanced substrate development assembly design for manufacturability design for reliability root cause analysis kLayout APD Solidworks

Benefits

medical
dental
vision
401(k)
paid parental leave

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2027 Spring Process Engineer Co-op - Doctorate (Gloucester, MA)

Applied Materials · Posted Nov 7, 2026

Gloucester, Massachusetts, United States
On-site
Internship
$47–$50 per hour
0+ years

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Co‑op Process Engineer in semiconductor R&D

Compensation

$47 - 50 per hour

Responsibilities

Work hands‑on with advanced semiconductor equipment and processes while following established laboratory safety procedures, including limited chemical handling as required.
Support laboratory and process development activities, including equipment preparation, wafer processing, wafer measurements and metrology, data collection and analysis, and documentation of experimental results.
Lead small‑scale development projects, analyze results, and present findings to engineering teams.
Support laboratory and process engineering activities as needed.

Requirements

Doctoral degree (or Master's) in Materials Science & Engineering, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related technical field
Nice to have: programming
Nice to have: data analysis
Nice to have: AI tools
Nice to have: Python

Skills

laboratory experience semiconductor processing wafer processing

2027 Spring Process Engineer Co-op - Doctorate (Gloucester, MA)

Applied Materials · Posted Nov 7, 2026

Gloucester, Massachusetts, United States
On-site
Internship · Intern
$47–$50 per hour

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Graduate student co‑op in advanced semiconductor process development at Applied Materials

Compensation

$47 - 50 per hour

Responsibilities

Work hands‑on with advanced semiconductor equipment and processes
Support laboratory and process development activities
Lead small‑scale development projects
Analyze results and present findings
Support laboratory and process engineering activities

Requirements

Doctoral or Master’s in Materials Science & Engineering, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or related field
Nice to have: Programming
Nice to have: Data analysis
Nice to have: AI-related tools
Nice to have: Python

Skills

Laboratory experience Semiconductor processing Wafer processing Metrology Data collection and analysis Experimental design

data collection

project management

Microsoft Copilot

Benefits

comprehensive benefits package

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Microsoft Copilot

Benefits

Comprehensive benefits package
Participation in bonus and stock award program

See full job description