Module Engineer specializing in Wafer-Level Assembly, Die Preparation, and Metrology for high-volume manufacturing and technology development.
Annual Salary Range for jobs which could be performed in the US: $103,730.00-198,820.00 USD
- Drive sustained operational excellence by proactively identifying and implementing safety and ergonomic improvements
- Collaborate with partner factories to transfer new processes and share best practices
- Develop and execute technology roadmaps to achieve process requirements
- Install, qualify, and ramp equipment and manufacturing processes for new product introductions
- Lead efforts to resolve complex technical challenges and implement robust systems
- Bachelor's degree in a STEM or related engineering discipline
- Master's degree in a STEM or related engineering discipline
- PhD in a STEM or related engineering discipline
- Nice to have: Hands-on experience in a semiconductor manufacturing environment
- Nice to have: Statistical analysis and experimental design methodologies
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