- Singapore
- Senior
- 5+ years
Lead integration of advanced packaging technologies in Singapore, driving architecture, qualification, and manufacturing readiness.
Responsibilities
- Serve as lead integrator for 3DHi and 2.5D technology development programs
- Define and integrate end-to-end process flows for chiplet-based 2.5D and 3DHi solutions
- Own integration trade‑off analysis across performance, reliability, yield, and manufacturability
- Define test‑site requirements and lead development of test structures and vehicles
- Establish process‑control, inspection, metrology, defectivity, and qualification strategies
Requirements
- Bachelor’s degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field
- Nice to have: Advanced degree in a relevant engineering or science discipline
- Nice to have: Experience in Singapore’s semiconductor ecosystem
- Nice to have: Established working relationships with Singapore‑based research institutes, universities, OSATs, equipment suppliers, materials vendors, or other advanced packaging partners
- Nice to have: Working knowledge of 2.5D/3D design enablement and co‑design considerations