- Hsinchu, Taiwan, Taiwan +1 more
- On-site
- Full-time · Senior
- 6+ years
An experienced ASIC Package Engineer focused on advanced packaging development, process integration, and designing custom silicons for infrastructure/AI/ML and networking applications.
Locations (2)
- Hsinchu, Taiwan, Taiwan
- Taipei, Taiwan, Taiwan
Responsibilities
- Perform package design for AI/ML and networking applications custom Si with single-chip/multi-chip and SiP/module packaging
- Design feasibility studies and analyses to ensure good manufacturing at ODM
- Lead development of disruptive advanced packaging technologies from concept to product, including test vehicle definition and building with ecosystem partners
- Work with internal Si, architecture and system teams, and externally with engaged partners, ODM, design houses and OSAT companies
- Perform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/3D and heterogeneous integration