Lead the development and optimisation of copper electrodeposition processes for fine-pitch RDL, microvias and high-aspect-ratio structures, investigate electrochemical kinetics, mass transport, current distribution, nucleation and deposition morphology, develop electrolyte formulations, additives and operating conditions, identify and eliminate deposition defects, design and execute rigorous experiments (DOE), develop stamp pre-plating, conditioning, recharging and cleaning processes, apply electrochemical characterisation techniques, correlate electrochemical behaviour with SEM/FIB cross-sections, surface metrology, material properties and electrical performance, collaborate closely with process and equipment engineers to translate laboratory results into scalable manufacturing systems, define electrochemical requirements for automated plating equipment, electrolyte delivery, multi-zone current control and in-line process monitoring, document experimental results, establish SOPs and drive continuous improvement in process yield, repeatability and throughput.
Competitive salary
Early-stage equity opportunities
- Set the technical direction for, and lead the development and optimisation of, copper electrodeposition processes for fine-pitch RDL, microvias and high-aspect-ratio structures.
- Investigate electrochemical kinetics, mass transport, current distribution, nucleation and deposition morphology.
- Develop electrolyte formulations, additives and operating conditions to improve uniformity, filling quality and defect performance.
- Identify and eliminate deposition defects, including voids, shorts, overplating, roughness and nonuniform growth.
- Design and execute rigorous experiments (DOE) to establish robust and reproducible process windows, and set the standard for experimental rigour across the team.
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