Engineer responsible for silicon quality and reliability for Google Cloud TPU hardware.
Locations (2)
Tel Aviv, Tel Aviv, Israel
Haifa, Haifa District, Israel
Responsibilities
Drive the strategic definition and development of Design-for-Reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Define and lead the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure robust silicon and package verification.
Execute comprehensive silicon and package qualification programs (including HTOL, ELFR, ESD/LU, b/HAST, etc.) and conduct in-depth failure analysis to resolve quality issues.
Extract and analyze large-scale data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical Quality and Reliability models (e.g., ELF, TDDB, NBTI) to predict device failure mechanisms and lifetime behaviors.
Requirements
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field
Nice to have: Master's degree in Electrical Engineering, Materials Science, or related fields
Nice to have: statistical data analysis using JMP, Python, or JSL
Nice to have: familiarity with Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA)
Nice to have: knowledge of Design-for-Reliability (DfR) rules and implementation techniques
Lead reliability assessment, qualification, and failure analysis for advanced silicon photonic optical engine packages within Cisco’s Optics Supply Chain organization.
Responsibilities
Define and execute reliability assessment and qualification plans for advanced silicon photonic optical engine packages
Collaborate with design, package integration, and process engineering teams to identify and mitigate failure modes
Lead root-cause analysis on reliability test failures and field returns using advanced metrology and optical testing
Ensure optical engine reliability aligns with system-level requirements for integration into pluggable optical modules
Requirements
M.S. degree in Physics, Electrical Engineering, Materials Science, or a related technical discipline
Nice to have: Ph.D. in a related engineering field
Module Engineer specializing in Wafer-Level Assembly, Die Preparation, and Metrology for high-volume manufacturing and technology development activities.
Compensation
Annual Salary Range for jobs which could be performed in the US: $76,390.00-146,440.00 USD
Responsibilities
Drive sustained operational excellence by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, and initiatives that enhance equipment availability, utilization, and cost efficiency.
Collaborate with partner factories to transfer new processes, maintain Copy Exactly standards, share best practices, and drive continuous improvements in processes and equipment performance.
Develop and execute technology roadmaps to achieve process requirements, business objectives, and key milestones.
Install, qualify, and ramp equipment and manufacturing processes to support new product introductions and production start-up milestones.
Lead efforts to resolve complex technical challenges and implement robust systems that prevent recurrence.
Requirements
Bachelor's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related technical field.
Nice to have: Master's degree
Nice to have: hands-on experience with semiconductor manufacturing equipment
Nice to have: working knowledge of DOE methodologies