Lead package development activities from early product definition and chip-package co-design through qualification and manufacturing ramp for high-performance semiconductor products.
Compensation
The US salary range for this full-time position is $128,700 to $239,100.
Responsibilities
Lead early chip-package co-design and package technology selection for new products.
Develop package solutions across technologies including FCCSP, FCBGA, FCQFN, WLCSP, QFN, and related package platforms.
Translate product, die, electrical, thermal, mechanical, reliability, manufacturing, and cost requirements into executable package designs.
Partner with cross-functional teams throughout the product development lifecycle.
Evaluate package architecture and material options against performance, cost, manufacturability, yield, reliability, and schedule requirements.
Requirements
Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related technical discipline
Master’s degree or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related discipline
Nice to have: advanced silicon nodes
Nice to have: complex high-performance package architectures
Lead reliability assessment, qualification, and failure analysis for advanced silicon photonic optical engine packages within Cisco’s Optics Supply Chain organization.
Responsibilities
Define and execute reliability assessment and qualification plans for advanced silicon photonic optical engine packages
Collaborate with design, package integration, and process engineering teams to identify and mitigate failure modes
Lead root-cause analysis on reliability test failures and field returns using advanced metrology and optical testing
Ensure optical engine reliability aligns with system-level requirements for integration into pluggable optical modules
Requirements
M.S. degree in Physics, Electrical Engineering, Materials Science, or a related technical discipline
Nice to have: Ph.D. in a related engineering field
The role involves directing reliability assessment and qualification of advanced optical engine packages, collaborating with internal teams and OSAT partners to develop robust packaging solutions.
Responsibilities
Define, execute, and own comprehensive reliability assessment and qualification plans for advanced silicon photonic optical engine packages, including complex architectures (e.g., flip-chip, 2.5D, and 3D integrated solutions).
Partner with design, package integration, and process engineering teams to identify thermomechanical, optical, and electrical failure modes early in the development cycle and drive robust corrective actions.
Lead root-cause analysis on reliability test failures and field returns utilizing advanced metrology, optical testing, and material characterization techniques.
Ensure optical engine reliability aligns strictly with system-level requirements to guarantee successful integration into pluggable optical modules.
Requirements
M.S. degree in Physics, Electrical Engineering, Materials Science, or a related technical discipline.
Nice to have: Ph.D. in a related engineering field
Drive growth and diversification of advanced microelectronics and Multi-Chip Module (MCM) manufacturing business, focusing on aerospace, medical, defense, and high-reliability electronics industries.
Responsibilities
Develop new business within aerospace, medical, defense, and other high-reliability electronics markets.
Identify and pursue prospective customers and manufacturing programs that align with MCM, SCM, microelectronics, and electronics assembly capabilities.
Establish relationships with engineering, supply chain, procurement, program management, and other key customer decision makers.
Develop and maintain a qualified pipeline of new business opportunities.
Serve as the technical and commercial interface between customers and internal engineering, manufacturing, quality, and operations teams.
Requirements
Bachelor’s degree in Engineering, Electronics, Manufacturing Engineering, Materials Science, Physics, or a related technical discipline
Nice to have: 10+ years of relevant industry experience
Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms.
Compensation
$131,900.00 - $241,500.00
Responsibilities
Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.
Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).
Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.
Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
Requirements
Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.
Nice to have: automated optical/electro-optical test setups
Join the team at the heart of memory innovation for every Apple product. As a Memory Packaging Engineer, you will architect the memory solutions that power the industry-leading performance of Apple's hardware.
Locations (3)
California, United States
Austin, Texas, United States
San Diego, California, United States
Responsibilities
Drive the definition, development, and qualification of next-generation memory packages
Guide the package roadmaps of memory partners
Collaborate with internal engineering teams to enable bandwidth and density scaling
Own the product lifecycle from concept through qualification
Join the team at the heart of memory innovation for every Apple product. As a Memory Packaging Engineer, you will architect the memory solutions that power the industry-leading performance of Apple's hardware.
Locations (3)
California, United States
Austin, Texas, United States
San Diego, California, United States
Responsibilities
Drive the definition, development, and qualification of next-generation memory packages critical to Apple’s future products.
Guide the package roadmaps of our memory partners and collaborate with internal engineering teams to enable bandwidth and density scaling.
Own the entire product lifecycle, from initial concept through qualification.
Requirements
Principal/Senior Principal Electromechanical Reliability Engineer
Lead reliability engineering for mission-enabling systems, diagnosing and mitigating component failures to ensure product performance and customer satisfaction.
PE Package EngineeringNewRambus · San Jose, US
Silicon Photonic Package Reliability and Qualification EngineerCisco · Taipei, Taiwan
Silicon Photonic Package Reliability and Qualification EngineerCisco · Taipei, Taiwan
Memory Packaging EngineerApple · US+2 more