Lead and develop high-output production systems for Joby's airframe assembly line, driving scale-up from several to hundreds of aircraft per year.
Compensation
Compensation at Joby is a combination of base pay and Restricted Stock Units (RSUs). The target base pay for this position is $128,800 - $221,000/yr.
Responsibilities
Make key contributions to the development of Joby's high-output production system to produce aircraft at rates that have not yet been achieved in the aerospace industry
Seek out and implement new manufacturing technologies and methods capable of dramatically accelerating assembly production rates
Collaborate with the tooling team to develop efficient and effective assembly tools oriented toward high-volume production
Collaborate with Joby's partners at Toyota to develop highly effective production tools and systems
Work closely with the Design and Stress teams to ensure that manufacturability guides all facets of the airframe design
Requirements
B.S. in Mechanical Engineering, Manufacturing Engineering, or a related discipline
Master's degree in Mechanical Engineering, Manufacturing Engineering, or a related discipline
Nice to have: Composite manufacturing (lamination, bonding, drilling, fastening)
Nice to have: Automated or robotic manufacturing systems
Nice to have: Aerospace manufacturing processes, specifications, and materials
Advanced packaging technology development engineer focused on silicon photonic packaging and electronic-photonic integration.
Compensation
The starting salary range posted for this position is $154,900.00 to $225,300.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits.
Responsibilities
Drive definition, design and analysis of packaging technology test vehicles
Drive validation of new technology against key performance metrics
Apply deep process expertise to oversee wafer processing, fine pitch bumping, D2W/W2W hybrid bonding, fanout, advanced substrate development, and assembly
Work with top-tier foundry and assembly partners to develop and qualify robust packaging solutions for high density photonics integration, CPO and on-board optics
Utilize design and modeling experience to guide Design for Manufacturability (DfM) and Design for Reliability (DfR)
Requirements
PhD or MS in Mechanical Engineering, Electrical Engineering, Physics, or a related field
Lead new product introduction engineering for medical device orthodontic products, ensuring compliance with regulatory and quality standards.
Compensation
$115,400 - $141,000
Responsibilities
Collaborate with R&D, QA, Regulatory Affairs, Manufacturing, Supply Chain, and Product Management teams
Support product teams through Phase-Gate development activities and deliverables
Participate in Design Control activities including planning, reviews, risk management, verification, validation, design transfer, and change management
Assist project teams in meeting internal quality system and regulatory requirements
Develop, execute, and document engineering studies, test methods, protocols, and technical reports
Requirements
Bachelor's degree in Mechanical Engineering, Biomedical Engineering, Manufacturing Engineering, or related Engineering disciplines
Nice to have: Understanding of EU MDR requirements
Nice to have: Familiarity with FDA, EU MDR, ISO 13485, ISO 14971
Nice to have: Experience with electro-mechanical integration
Manage packaging machine design projects from concept through final testing following Ossid‘s Engineering Development Process and Stage Gate Process while adhering to project scope and timeline requirements.
Lead the development of 3D CAD models, layouts, BOMs and detailed drawings for mechanical systems and assemblies.
Lead design efforts while working closely with peers, Product Line Managers, manufacturing, assembly technicians, electrical/controls engineering, and service teams to ensure design integrity, manufacturability, and ease of maintenance.
Apply a strong understanding of controls system components and machine automation to influence mechanical design decisions.
Oversee prototype build, debug, and final machine testing; incorporate feedback from manufacturing and testing into final designs.
This role requires a highly experienced technical leader who thrives in complex, multidisciplinary environments and is motivated by solving challenging, system‑level problems.
Compensation
The annual salary range for this position is $104,134- $163,640. The actual compensation may vary based on geographic location, work experience, education, and skill level. The salary range is CONMED’s good faith belief at the time of this posting.
Responsibilities
Lead system-level electrical design across complex mixed-signal systems
Provide technical leadership and mentorship to junior engineers, promoting strong engineering practices, technical rigor, and effective project execution.
Own technical workstreams and manage sub‑projects, ensuring alignment with overall program objectives, milestones, and delivery timelines.
Collaborate with cross-functional teams to evaluate feasibility, maturity, and risk of advanced technologies, conducting hands-on experiments and defining verification, validation, and risk mitigation strategies.
Act as a technical liaison across engineering disciplines, leading advanced problem-solving efforts for complex system-level challenges.
Requirements
B.S. in Electrical Engineering (or highly related field)
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