Lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms, collaborating across photonics, electrical, mechanical, and manufacturing teams.
Expected Salary Range
$131,900.00 - $241,500.00
- Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules
- Develop and implement scalable fiber-to-chip coupling strategies
- Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies
- Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability
- Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools
- Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field
- Nice to have: Automated optical/electro-optical test setups
- Nice to have: Motion control systems
- Nice to have: Python
- Nice to have: Co-packaged optics (CPO)
- Reasonable accommodation available
