Referso Jobs

Principal Package Development Engineer

Rambus · Posted Nov 10, 2026

Open

San Jose, California, United States
Hybrid
Full-time · Principal
$129K–$239K per year
7+ years

Principal Package Development Engineer

Rambus · Posted Nov 10, 2026

Open

San Jose, California, United States
Hybrid
Full-time · Principal
$129K–$239K per year
7+ years

Silicon Photonic Package Reliability and Qualification Engineer

Cisco · Posted Nov 10, 2026

Open

Taipei, Taiwan, Taiwan
5+ years

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Lead reliability assessment, qualification, and failure analysis for advanced silicon photonic optical engine packages within Cisco’s Optics Supply Chain organization.

Responsibilities

Define and execute reliability assessment and qualification plans for advanced silicon photonic optical engine packages
Collaborate with design, package integration, and process engineering teams to identify and mitigate failure modes
Lead root-cause analysis on reliability test failures and field returns using advanced metrology and optical testing
Ensure optical engine reliability aligns with system-level requirements for integration into pluggable optical modules

Requirements

M.S. degree in Physics, Electrical Engineering, Materials Science, or a related technical discipline
Nice to have: Ph.D. in a related engineering field
Nice to have: Silicon Photonics
Nice to have: optical transceivers
Nice to have: fiber coupling

Skills

advanced packaging technologies Flip-Chip Wafer-Level Packaging 2.5D/3D IC

Silicon Photonic Package Reliability and Qualification Engineer

Cisco · Posted Nov 10, 2026

Open

Taipei, New Taipei, Taiwan
Senior
5+ years

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The role involves directing reliability assessment and qualification of advanced optical engine packages, collaborating with internal teams and OSAT partners to develop robust packaging solutions.

Responsibilities

Define, execute, and own comprehensive reliability assessment and qualification plans for advanced silicon photonic optical engine packages, including complex architectures (e.g., flip-chip, 2.5D, and 3D integrated solutions).
Partner with design, package integration, and process engineering teams to identify thermomechanical, optical, and electrical failure modes early in the development cycle and drive robust corrective actions.
Lead root-cause analysis on reliability test failures and field returns utilizing advanced metrology, optical testing, and material characterization techniques.
Ensure optical engine reliability aligns strictly with system-level requirements to guarantee successful integration into pluggable optical modules.

Requirements

M.S. degree in Physics, Electrical Engineering, Materials Science, or a related technical discipline.
Nice to have: Ph.D. in a related engineering field
Nice to have: Silicon Photonics (SiPh)
Nice to have: optical transceivers
Nice to have: fiber coupling

Skills

semiconductor backend packaging reliability

Business Development Manager

ChampionX (now part of SLB) · Posted Nov 9, 2026

Open

West Valley City, Utah, United States
Senior
8+ years

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Drive growth and diversification of advanced microelectronics and Multi-Chip Module (MCM) manufacturing business, focusing on aerospace, medical, defense, and high-reliability electronics industries.

Responsibilities

Develop new business within aerospace, medical, defense, and other high-reliability electronics markets.
Identify and pursue prospective customers and manufacturing programs that align with MCM, SCM, microelectronics, and electronics assembly capabilities.
Establish relationships with engineering, supply chain, procurement, program management, and other key customer decision makers.
Develop and maintain a qualified pipeline of new business opportunities.
Serve as the technical and commercial interface between customers and internal engineering, manufacturing, quality, and operations teams.

Requirements

Bachelor’s degree in Engineering, Electronics, Manufacturing Engineering, Materials Science, Physics, or a related technical discipline
Nice to have: 10+ years of relevant industry experience
Nice to have: aerospace experience
Nice to have: defense experience
Nice to have: medical devices experience

Skills

technical sales business development

PMTS Silicon Photonics Packaging Integration

GlobalFoundries · Posted Nov 9, 2026

Open

Essex Junction, Vermont, United States
On-site
Full-time · Senior
$132K–$242K per year
15+ years

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Lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms, collaborating across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures.

Compensation

Expected Salary Range $131,900.00 - $241,500.00

Responsibilities

Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules
Develop and implement scalable fiber-to-chip coupling strategies
Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies
Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability
Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools

Requirements

Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field
Nice to have: Automated optical/electro-optical test setups
Nice to have: Motion control systems
Nice to have: Python
Nice to have: Co-packaged optics (CPO)

Skills

Semiconductor packaging Photonic packaging

Principal Package Development Engineer

Principal Package Development Engineer

Compensation

Responsibilities

Requirements

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Silicon Photonic Package Reliability and Qualification Engineer

Responsibilities

Requirements

Skills

Silicon Photonic Package Reliability and Qualification Engineer

Responsibilities

Requirements

Skills

Business Development Manager

Responsibilities

Requirements

Skills

PMTS Silicon Photonics Packaging Integration

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Responsibilities

Requirements

Skills

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Flip-chip jobs

Compensation

Responsibilities

Requirements

Skills

Benefits

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Skills

Responsibilities

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Skills

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Compensation

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