Support the manufacturing and development of wafer fabrication processes in a cleanroom environment.
Compensation
In the United States, work locations are assigned a pay zone which determines the salary range for the position. The successful candidate’s starting pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions. The starting pay may be negotiable within the salary range for the position. These pay zones may be modified in the future.
Zone A (CA, WA, NYC):
The base hourly range for this position is $38.94-$58.17 hourly.
Zone B:
The base hourly range for this position is $37.01-$55.28 hourly.
Zone C:
The base hourly range for this position is $33.17-$49.51 hourly.
This position is eligible for equity in the form of RSUs.
Responsibilities
Operate, monitor, and maintain fab process tools
Support production by running wafer lots to specification
Perform tool qualifications and preventive maintenance
Conduct in-line metrology and inspection
Respond to out-of-control events
Requirements
High school diploma or equivalent
Associate’s degree or technical certificate in electronics, engineering technology, materials science, or a related field
Lead design, development, and optimization of manufacturing equipment for solar cell production.
Compensation
Canadian Solar offers a competitive salary plus fully comprehensive benefits and performance bonus package based on an annual objective achievement.
Responsibilities
Lead the design, development, and implementation of advanced manufacturing equipment and processes.
Take ownership of troubleshooting and resolving the most complex equipment issues, ensuring minimal disruption to production.
Develop and oversee the execution of strategies for preventive and predictive maintenance, ensuring maximum equipment uptime.
Collaborate with cross-functional teams and vendors to lead large-scale equipment projects, including upgrades, installations, and process improvements.
Serve as the subject matter expert for solar cell production technologies and equipment optimization.
Requirements
Bachelor’s degree in mechanical, electrical, electronic, mechatronic, or a related field
Support process engineers in the research, development, and optimization of semiconductor processes, including ALD, PEALD, Epitaxy, PECVD, oxidation, annealing, and/or curing.
Responsibilities
Support process engineers in the research, development, and optimization of semiconductor processes, including ALD, PEALD, Epitaxy, PECVD, oxidation, annealing, and/or curing.
Assist with the design and execution of experiments to evaluate process performance, materials properties, and equipment capabilities.
Collect, analyze, and interpret experimental data with guidance from experienced engineers.
Gain exposure to Design of Experiments (DOE) and other structured problem-solving methodologies used in semiconductor process development.
Support thin-film development and characterization for emerging semiconductor applications.
Requirements
Master’s in Chemical Engineering
Master’s in Materials Science or Materials Engineering
Field Service Engineer responsible for installation, maintenance, troubleshooting, and upgrades of semiconductor manufacturing equipment at customer sites.
Responsibilities
Install and support semiconductor manufacturing equipment (ALD, Epitaxy, PECVD)
Perform regular maintenance and inspections to ensure stable operation
Diagnose and repair equipment during trouble events
Upgrade and modify equipment to improve performance and productivity
Respond to technical inquiries and provide operational support
Lead the development, optimization, and support of advanced PECVD processes for semiconductor customers, primarily in Korea with a focus on Japan-based projects.
Responsibilities
Develop, optimize, and support PECVD processes for dielectric and functional thin films for logic, memory, analog, power, and MEMS applications.
Design, execute, and analyze complex experiments using DOE and RSM, and interpret advanced process and materials characterization results.
Drive process transfer, customer demonstrations, and high‑volume manufacturing (HVM) support.
Troubleshoot process and equipment issues through hands‑on engagement and structured problem‑solving methodologies.
Collaborate with global R&D, field service, and marketing teams to define customer requirements and deliver robust process solutions.
Requirements
Master’s degree or PhD in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field.
Manage semiconductor fabrication processes within the FAB, overseeing process qualification, production, and control methodologies.
Locations (2)
Borgaro Torinese, Piedmont, Italy
Torino, Emilia-Romagna, Italy
Responsibilities
Manage silicon wafer diode production processes across cost, quality and qualification, including photolithography, etching, dry and wet diffusion furnaces, PVD, PECVD, ion implantation, grinding and evaporation
Manage innovation technical projects (FAB process and methods, process automation, diode platforms)
Manage large datasets, statistical analyses and DOE modelling using JMP
Identify and evaluate new process opportunities, silicon suppliers and specifications, production and cost optimization initiatives, and root causes of yield and cost issues
Manage 8D problem‑solving activities and technical discussions with Quality and R&D departments
Intern, Process EngineeringASM · Phoenix, US