Develop, support, and improve surface-mount technology (SMT) assembly and box-build processes, while supporting lean manufacturing, process improvement, factory-layout design, and practical automation solutions in a fast-paced electronics manufacturing environment.
Compensation
Pay: From CA$70,000.00 per year
· Competitive salary with a performance-based bonus.
Responsibilities
Develop and support SMT assembly
Engineer box-build processes
Launch new products
Stabilize quality and production
Build production capability
Requirements
Degree in Electronics, Electrical, Manufacturing, Industrial, Mechanical, Mechatronics, Process Engineering, or a related field
Nice to have: Automated optical inspection
Nice to have: Production testing
Nice to have: Process failure mode and effects analysis
Manage the hire desk function, coordinate plant and equipment hire, maintain supplier relationships, and ensure compliance and cost-effective operations across the region.
Locations (2)
Heathfield, England, United Kingdom
Newton Abbot, England, United Kingdom
Responsibilities
Lead and manage day-to-day operations of the hire desk
Coordinate booking, allocation, and off-hiring of plant, vehicles, and specialist equipment
Ensure hire requests are fulfilled efficiently
Develop and maintain effective scheduling processes
Manage relationships with external hire suppliers
Requirements
GCSEs (or equivalent) including Maths and English at Grade C/4 or above
Nice to have: Experience within highways, construction, or infrastructure sectors
Nice to have: Familiarity with plant hire systems or fleet management software
Nice to have: Understanding of legislation and compliance requirements (e.g. LOLER, PUWER)
Electronics Assembly Technician
Johns Hopkins Applied Physics Laboratory · Posted Nov 9, 2026
Assemble cable, wire harness, magnetic, and electronic circuit assemblies for national security and space applications, involving hand soldering, component placement, and system integration.
Compensation
Minimum Rate $30.00 Hourly
Maximum Rate $57.05 Hourly
Responsibilities
Hand solder and hand place components and connectors on printed circuit boards
Build harnesses and cables
Wind toroids and transformers
Perform rework/repair of non-conforming hardware
Integrate complex electronic subsystems into operational systems
Requirements
High School Diploma or equivalent
Nice to have: Assembly and soldering of electronic printed wiring boards and cable assemblies in a high mix, low volume SMT facility
Nice to have: Building electronic hardware for spacecraft
Nice to have: Wiring chassis
Nice to have: Electro-mechanical systems experience
Responsible for developing, setting up, optimizing, and sustaining Flip Chip BGA assembly processes, with primary focus on Heat Spreader Attachment and Ball Attachment processes.
Responsibilities
Develop and optimize Flip Chip BGA assembly processes
Set up and evaluate assembly equipment
Improve yield and reduce defects
Support high-volume manufacturing operations
Collaborate with production, quality, equipment, and product engineering teams
Requirements
Bachelor’s Degree in any Engineering related field
Key leader on the Manufacturing Engineering team steering the product lifecycle from initial development to mass production and beyond. Instrumental in launch and ongoing support of hardware products.
Compensation
$139,400.00 - $225,500.00/yr
Responsibilities
Lead Design for Excellence (DFx) by championing DFx principles and engaging in design reviews from the earliest stages of product development
Ensure manufacturability, quality, time-to-market, and cost targets are met for new hardware products
Take full ownership of factory leadership and strategic readiness
Collaborate with cross-functional teams and contract manufacturing partners to deliver cybersecurity products
Manage the product lifecycle from design phase to factory floor and supply chain
Requirements
Bachelor's degree in relevant engineering discipline
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