Lead package development activities from early product definition and chip-package co-design through qualification and manufacturing ramp.
Compensation
The US salary range for this full-time position is $128,700 to $239,100.
Responsibilities
Lead early chip-package co-design and package technology selection for new products
Develop package solutions across technologies including FCCSP, FCBGA, FCQFN, WLCSP, QFN, and related package platforms
Translate product, die, electrical, thermal, mechanical, reliability, manufacturing, and cost requirements into executable package designs
Partner with Chip Design, SI/PI, Product Engineering, Test, Quality, Reliability, Marketing, Supply Chain, and other cross-functional teams throughout the product development lifecycle
Evaluate package architecture and material options against performance, cost, manufacturability, yield, reliability, and schedule requirements
Senior Mechanical Engineer responsible for structural and thermal analysis of defense electronics, EO/IR systems, RF hardware, avionics, and mission-critical products within Aerospace & Mission Systems (AMS).
Responsibilities
Serve as the recognized subject matter expert and technical authority for structural and thermal analysis of defense electronics, EO/IR systems, RF hardware, avionics, and mission-critical products.
Influence product architectures, design decisions, technology roadmaps, and long‑range engineering strategy through early lifecycle analysis, risk assessment, and technical consultation.
Lead the resolution of complex structural, thermal, vibration, shock, fatigue, and electronics reliability challenges using advanced analytical methods and simulation technologies.
Provide independent technical oversight and approval of finite element modeling approaches, assumptions, validation methods, and analytical conclusions for high‑consequence engineering decisions.
Chair the Structural and Thermal Analysis Review Board, establishing and enforcing expectations for technical rigor, documentation quality, model credibility, validation requirements, and engineering excellence across AMS programs.
Requirements
Bachelor's Degree in Mechanical Engineering, Aerospace Engineering, or a related engineering discipline
Nice to have: Master's Degree or PhD in Mechanical Engineering, Aerospace Engineering, or a related discipline
Senior Hardware Engineer responsible for leading and executing hardware development activities for embedded controllers, mixed analog/digital systems, communication devices, motor-drive interfaces, power converters, and industrial electronics.
Responsibilities
Lead the design and development of mixed analog and digital hardware for embedded control, communications, sensing, motor-drive interfaces, and power conversion systems.
Own the full PCBA design lifecycle, including architecture, requirements analysis and definition, schematic design, PCB layout review, component selection, prototyping, bring-up, validation, and production release.
Define hardware requirements, design trade-offs, validation strategy, and acceptance criteria.
Model and analyze electrical systems such as power converters, motor-drive circuits, protection circuits, and control interfaces.
Support or define digital control requirements based on simulations, calculations, and experimental data.
Requirements
Bachelor’s degree in Electrical Engineering
Bachelor’s degree in Electronics Engineering
Bachelor’s degree in Mechatronics Engineering
Bachelor’s degree in Control and Automation Engineering
Design and develop high-speed IO circuits for next-generation memory interface PHY IPs including DDR, HBM, and UCIe in advanced CMOS, FinFET, and GAA process nodes.
Responsibilities
Design and develop high-speed IO circuits for next-generation memory interface PHY IPs
Execute circuit design tasks from architecture through layout, simulation, and verification with a focus on performance, power, and area optimization
Analyze and solve complex analog design challenges in advanced technology nodes
Collaborate with global cross-functional teams to deliver integrated PHY solutions
Apply ESD and reliability principles to ensure robust circuit design
Requirements
Bachelor's or Master's degree in Electronics Engineering, Electrical Engineering, or related field
Nice to have: knowledge of JEDEC memory interface standards (DDR, HBM, LPDDR)
Nice to have: familiarity with signal integrity and power integrity concepts
