Provide on-site professional technical support, primarily in North America, and develop innovative solutions to customer challenges in semiconductor manufacturing.
Compensation
Join Thermo Fisher Scientific and enjoy competitive pay, annual bonuses, healthcare, 401(k) plans, and various employee benefits such as: National medical, dental, and vision plans, Employee assistance and family support, Commuter benefits and tuition reimbursement, Generous paid time off and holiday, Paid parental leave, Accident, life insurance, and disability coverage, Retirement savings programs, Employee Stock Purchase Plan with discounts
Responsibilities
Provide on-site professional technical support, primarily in North America
Develop innovative solutions to customer challenges
Support tool acceptance and new technologies on location and in coordination with the product and service teams
Coordinate closely with internal product, engineering, marketing and account teams on product acceptance and development
Provide detailed technical feedback to the product teams on customer needs and product performance in the field
Requirements
Minimum of an undergraduate degree in Physics, Materials Science, Chemistry, or a related field; an advanced degree is preferred
Nice to have: Coding or scripting (C#, Python, MATLAB)
Field Applications Engineer responsible for enabling customers in the integration of TEM tools into semiconductor processes for development and production.
Responsibilities
Provide on-site professional technical support
Develop innovative solutions to customer challenges
Support tool acceptance and new technologies
Develop positive relationships with customers
Provide detailed technical feedback to product teams on customer needs and performance
Work hands‑on with advanced semiconductor equipment and processes while following established laboratory safety procedures, including limited chemical handling as required.
Support laboratory and process development activities, including equipment preparation, wafer processing, wafer measurements and metrology, data collection and analysis, and documentation of experimental results.
Lead small‑scale development projects, analyze results, and present findings to engineering teams.
Support laboratory and process engineering activities as needed.
Requirements
Doctoral degree (or Master's) in Materials Science & Engineering, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related technical field
Develop, optimize, and validate electronics manufacturing and semiconductor manufacturing processes using PulseForge technologies, executing experimental plans and contributing to process innovation.
Compensation
$115,000- $120,000 annual, commensurate on experience.
Responsibilities
Develop and implement internal process development projects
Design and execute experiments (DOE) to optimize processing conditions
Maintain ownership of technical development projects
Collaborate with mechanical, electrical, and software engineering teams
Support prototype tool validation and process qualification
Requirements
Bachelor’s degree in Engineering, Physics, Materials Science, Chemistry, or a related field
Nice to have: Master’s degree or higher in engineering, material sciences or physical sciences
Nice to have: cleanroom experience
Nice to have: semiconductor device manufacturing processes
Process Integration Intern within the Keysight Labs/High Frequency Technology Center, contributing to next-generation heterogeneous integration and advanced packaging technologies.
Compensation
(PhD) CA Pay Range-$55.14 - $59.38
Responsibilities
Assisting with the planning, execution, and documentation of engineering experiments to evaluate process, material, and equipment performance.
Collecting, analyzing, and interpreting process, defectivity, metrology, and electrical test data to identify trends and improvement opportunities.
Investigating process integration challenges and supporting root cause analysis of yield, quality, and reliability issues.
Collaborating with process, equipment, yield, metrology, and product engineers to drive continuous improvement initiatives.
Evaluating the interaction of process steps across the manufacturing flow and assessing their impact on device performance, yield, and manufacturability.
Requirements
Graduate student pursuing M.S. or Ph.D. in Electrical Engineering
Graduate student pursuing M.S. or Ph.D. in Mechanical Engineering
Graduate student pursuing M.S. or Ph.D. in Chemical Engineering
Graduate student pursuing M.S. or Ph.D. in Materials Science
Graduate student pursuing M.S. or Ph.D. in Chemistry
Skills
Silicon Photonics Process Integration Intern (Summer 2027)
Support the 300mm semiconductor technology development integration team by contributing to the process integration of silicon photonic devices across development, customer engagement, qualification, and production readiness.
Locations (2)
New York, New York, United States
Malta
Compensation
$20.00 - $40.00
Responsibilities
Collaborate with device, process module, packaging, test, and integration teams to develop and drive silicon photonics input/output solutions.
Learn integration module ownership while supporting the development and qualification of silicon photonics input/output processes and structures.
Assist with analysis of process, device, and yield data to identify trends, document results, and support technical problem solving.
Support project execution through experiment tracking, status communication, and preparation of technical summaries for cross-functional stakeholders.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader
Lead a team of engineers to support high-volume manufacturing processes and drive advancements within Intel's next-generation packaging technologies.
Compensation
Annual Salary Range for jobs which could be performed in the US: $120,860.00-231,670.00 USD
Responsibilities
Lead and manage a team of engineers to support safe, high-volume manufacturing processes while driving continuous improvements in quality, output, cost, and yield.
Provide tactical direction and prioritize activities for sustaining operations, systematic troubleshooting, and process optimization.
Collaborate with cross-functional engineering and manufacturing teams to address integrated process and equipment challenges.
Develop and mentor engineers, cultivating technical expertise, leadership skills, and long-term growth opportunities within the team.
Facilitate technology transfer and ensure matched processing across global sites through training sessions and audits.
Requirements
Bachelor's degree in engineering, materials science, physics, or a related technical field
Support process development, optimization, qualification, and troubleshooting activities for advanced semiconductor manufacturing equipment as a Field Process Engineer Intern.
Responsibilities
Support process development, optimization, characterization, and troubleshooting activities on semiconductor manufacturing equipment.
Assist with the design, execution, and analysis of experiments to evaluate process performance and identify opportunities for improvement.
Analyze experimental and process data to identify trends, relationships, and potential areas for optimization.
Gain hands‑on exposure to thin‑film deposition, semiconductor processing, vacuum systems, equipment operation, and process characterization.
Work alongside engineers to investigate process and equipment issues using structured problem‑solving techniques.
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