Provide technical leadership and manufacturing support for advanced detector processes, drive process improvements, and lead equipment qualification and production release.
Compensation
For U.S. based positions only, the pay range for this position is $105,600.00-$158,400.00 Annual. It is not typical for an individual to be hired at or near the top of the pay range and compensation decisions are dependent on the facts and circumstances of each case. The specific compensation offered to a candidate may be influenced by a variety of factors including skills, qualifications, experience and location. In addition, this position may also be eligible to earn performance based incentive compensation, which may include cash bonus(es) and/or long term incentives (LTI).
Responsibilities
Provide technical leadership for HLA, CsI deposition, parylene coating, laser/mechanical scribing, epoxy sealing and related detector back-end manufacturing processes.
Establish and maintain robust process windows, recipes, operating parameters, and manufacturing controls.
Troubleshoot complex process and equipment issues using structured problem-solving and root-cause analysis; lead corrective actions and production recovery as needed.
Monitor and analyze yield, first-pass yield (FPY), defect trends, process capability, equipment performance, and critical-to-quality (CTQ) metrics to identify and prioritize improvements.
Apply statistical process control (SPC), design of experiments (DOE), Lean, Six Sigma, and FMEA methodologies to improve process capability, yield, cycle time, equipment uptime, and manufacturing efficiency.
Technology leader responsible for driving Co-Packaged Optics (CPO) and Silicon Photonics technology development from concept to high-volume manufacturing.
Responsibilities
Work with product architects and Silicon Photonics technology teams to define optical engine architectures, package architectures, and long-term technology roadmaps.
Drive Silicon Photonics technology development from wafer process integration through packaging, qualification, and production deployment.
Partner with foundries to develop and optimize Silicon Photonics manufacturing processes, yield strategies, and technology qualification plans.
Design multi-fiber optical connectors and work with ecosystem partners to establish scalable optical connectivity solutions.
Enable new package technology development initiatives including 2.5D, 3D, hybrid bonding, and optical packaging technologies from concept to full qualification.
Lead end-to-end NPI-to-HVM industrialization of advanced packages across external OSAT and foundry partners
Coordinate ramp plans, risk mitigation, and readiness reviews to ensure stable yield and predictable scale-up
Support ongoing manufacturing and operations, and lead sustaining engineering to maintain stable yield, quality, and delivery in high-volume production
Serve as the primary interface between package design, technology development, and external partners to ensure manufacturable package architectures
Drive end-to-end DFM integration, identifying and closing manufacturability and technology-to-manufacturing gaps early
Requirements
Bachelor’s or master’s degree in mechanical engineering
Bachelor’s or master’s degree in materials science
Bachelor’s or master’s degree in electrical engineering
Bachelor’s or master’s degree in chemical engineering
Bachelor’s or master’s degree in a related engineering discipline
Engineer responsible for monitoring, operating, and maintaining semiconductor process equipment, performing preventive and corrective maintenance, troubleshooting, and driving tool availability and reliability improvements.
Responsibilities
Monitor, operate, and maintain semiconductor process equipment
Perform preventive and corrective maintenance
Respond to equipment alarms and abnormalities
Act as Tool Owner for assigned tools
Analyze equipment data and history
Requirements
Bachelor's degree in Engineering or related fields
Nice to have: experience as a Tool Owner
Nice to have: familiarity with equipment data analysis
Principal Mechanical Engineer - Manufacturing Process to provide technical leadership for the development, characterization, validation and production readiness of manufacturing and assembly processes for complex precision electromechanical products.
Compensation
Pay range / Rango salarial / Intervalo salarial /Fascia retributiva / Tranche de salaire / Gehaltsband / Salaribereik: Ireland: 81,120.00 EUR - 121,680.00 EUR | The final salary within this range will be determined based on objective, job-related criteria, including relevant experience, skills and qualifications, in accordance with our compensation framework. This position is eligible for a short-term incentive called the Medtronic Incentive Plan (MIP).
Responsibilities
Own manufacturing and assembly process development across multiple related product lines, from early lab development and pilot-line builds through validated Manufacturing release and ramp-up.
Develop a deep understanding of product design, critical characteristics, tolerance chains, component variation, interfaces and product-process interactions.
Translate product requirements and design intent into robust process flows, assembly concepts, operating windows, acceptance criteria and control strategies.
Lead lab and pilot-line builds, DOE, process characterization, optimization, capability studies and structured technical investigations.
Establish and maintain process risk and control documentation, including process flows, PFMEA, control plans, work instructions and supporting engineering evidence.
Requirements
Bachelor’s or advanced degree in Mechanical, Manufacturing, Mechatronics or a related engineering discipline
Bachelor's degree in Mechanical Engineering, Industrial Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Manufacturing Engineering, or a related technical discipline
Associate's degree in a related technical discipline
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