The Senior Manager, Store of the Future, leads a portfolio of strategic design initiatives that advance the future store experience.
Compensation
The annual salary range for this position is $80,000.00 - $155,000.00
Additional compensation includes annual or quarterly performance bonuses.
Additional compensation for certain positions may also include :
- Stock
Responsibilities
Develop and adapt store design solutions aligned with business strategies to enhance sales and operational efficiency.
Lead design sessions and collaborate with cross-functional teams including Merchandising, Real Estate, and Operations.
Oversee project implementation, monitor progress, and approve scalable design solutions.
Identify opportunities for improvement and recommend design enhancements to optimize space allocation and customer experience.
Manage multiple projects by setting priorities, removing obstacles, and adjusting plans to meet business objectives.
Requirements
Bachelor’s degree in drafting technology, computer aided drafting, drafting and design technology, architectural design, or related field
Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science in Engineering
Bachelor's Degree or Equivalent
Nice to have: Active U.S. Top Secret/SCI Security Clearance
Nice to have: Experience within aerospace or related industry or with space electronics
Nice to have: Experience leading teams on complex projects
Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Compensation
Summary pay range: $146,200 - $197,800
Responsibilities
Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Active U.S. Top Secret/SCI Security Clearance
Nice to have: Experience within aerospace or related industry or with space electronics
Nice to have: 3+ years of experience leading teams on complex projects
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer
Design, analyze, and support space electronics packaging and mechanical products, including structural, thermal, and vibration analysis, PCB layout, and integration with satellite systems.
Compensation
Summary Pay Range (Associate - Level 2): $98,600- $133,400
Summary Pay Range (Mid-Level - Level 3): $119,850- $162,150
Responsibilities
Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Mid-Level (Level 3): 5+ years of related work experience or an equivalent combination of technical education and experience
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Associate)
Design and analyze space electronics packaging and mechanical products, performing structural, thermal, and vibration analysis, and collaborating with cross‑disciplinary teams.
Compensation
Summary Pay Range: $98,600- $133,400
Responsibilities
Coordinate with multi‑discipline groups to develop and understand requirements and develop high‑level and detailed designs consistent with those requirements
Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Perform detailed structural and thermal analysis using hand calculations and analysis tools
Document structural analyses and data to show compliance with Boeing, customer and regulatory requirements
Collaborate with Electrical Engineering team to perform sizing and placement studies and layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Active U.S. Top Secret/SCI Security Clearance
Nice to have: Experience within aerospace or related industry or with space electronics
Nice to have: Experience leading teams on complex projects
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Subject Matter Expert)
Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Compensation
Summary pay range: $146,200 - $197,800
Responsibilities
Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Active U.S. Top Secret/SCI Security Clearance
Nice to have: Experience within aerospace or related industry or with space electronics
Nice to have: Experience with ANSYS analysis, Creo CAD, SolidWorks, Finite Element Analysis (FEA), Siemens NX Nastran, MSC Patran, COMSOL Multiphysics
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer
Design and analyze space electronics packaging and mechanical components for satellite missions, performing structural, thermal, and vibration analysis, and collaborating with multi-discipline teams.
Compensation
Summary Pay Range (Associate - Level 2): $98,600- $133,400
Summary Pay Range (Mid-Level - Level 3): $119,850- $162,150
Responsibilities
Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Mid-Level (Level 3): 5+ years of related work experience or an equivalent combination of technical education and experience
Entry-Level Mechanical Product Design and Analysis Engineer
Design and analyze mechanical products for space electronics packaging, including PCB layout, thermal and structural analysis, and integration with electrical systems.
Compensation
Summary pay range: $79,050 - $106,950
Responsibilities
Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (Electrical, Mechanical or Aeronautical)
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