- Taipei, Taiwan, Taiwan
- On-site
- Internship · Intern
Hardware Engineering Intern focused on system and subsystem board development for next‑generation server and storage products.
Responsibilities
- Perform high‑fidelity simulation modeling (CAD cleanup, meshing) on complex 3D assemblies to quantify stress, deformation, and strain energy under extreme loads.
- Predict natural frequencies and mode shapes. Conduct harmonic response, random vibration, and transient dynamics analyses to evaluate structural integrity under operational and shipping vibration profiles.
- Plan physical vibration tests and execute Experimental Modal Analyses (EMA) using shakers, modal hammers, accelerometers, and DAQ hardware to extract Frequency Response Functions (FRFs).
- Correlate simulation models with physical test data (e.g., MAC matrices). Calibrate boundary stiffness, damping, and material properties to maximize FEA accuracy.
Requirements
- PhD in Mechanical Engineering, Applied Mechanics, Civil Engineering or related technical field
- Nice to have: Experience in product design
- Nice to have: validation
- Nice to have: CAD/CAE tools