- Ottawa, Ontario, Canada
- On-site
- Full-time · Principal
- CA$175K–CA$195K per year
- 10+ years
As the Technical Fellow, Advanced Packaging Integration, you’ll be a central figure in that mission, a recognized technical authority who bridges advanced packaging, processor architecture, and system-level performance. This is a rare opportunity to shape the technical direction of two of TechInsights’ most dynamic product areas: Advanced Packaging and High Performance Computing.
Compensation
Expected salary range: $175,000 - $195,000 CAD
Responsibilities
- Serve as TechInsights’ subject matter expert across advanced packaging, HPC processors, networking ASICs, and memory integration
- Provide authoritative insights on leading-edge and emerging packaging and system integration technologies
- Shape and maintain TechInsights’ Advanced Packaging and HPC technology roadmaps
- Identify and prioritize parts and systems for analysis across processors, accelerators, and networking platforms
- Help drive product evolution toward system-level analysis, including server performance testing, interconnect and power delivery characterization, and thermal benchmarking
Requirements
- Master’s in Nanotechnology
- PhD in Nanotechnology
- Master’s in Electrical Engineering
- PhD in Electrical Engineering
- Master’s in Materials Science