Responsible for FCBGA/WLCSP post‑process manufacturing, including yield, quality, cost improvement, defect handling, and coordination with overseas vendors.
Responsibilities
Develop and validate post‑process techniques for FCBGA/WLCSP
Improve yield, quality, and cost during production
Handle defect investigations and root‑cause analysis
Coordinate with overseas vendors for process support
Requirements
Nice to have: Experience with FCBGA package yield improvement
Nice to have: Experience with WLCSP yield improvement
Nice to have: Experience with overseas vendor coordination
Provide technical leadership and manufacturing support for advanced detector processes, drive process improvements, and lead equipment qualification and production release.
Compensation
For U.S. based positions only, the pay range for this position is $105,600.00-$158,400.00 Annual. It is not typical for an individual to be hired at or near the top of the pay range and compensation decisions are dependent on the facts and circumstances of each case. The specific compensation offered to a candidate may be influenced by a variety of factors including skills, qualifications, experience and location. In addition, this position may also be eligible to earn performance based incentive compensation, which may include cash bonus(es) and/or long term incentives (LTI).
Responsibilities
Provide technical leadership for HLA, CsI deposition, parylene coating, laser/mechanical scribing, epoxy sealing and related detector back-end manufacturing processes.
Establish and maintain robust process windows, recipes, operating parameters, and manufacturing controls.
Troubleshoot complex process and equipment issues using structured problem-solving and root-cause analysis; lead corrective actions and production recovery as needed.
Monitor and analyze yield, first-pass yield (FPY), defect trends, process capability, equipment performance, and critical-to-quality (CTQ) metrics to identify and prioritize improvements.
Apply statistical process control (SPC), design of experiments (DOE), Lean, Six Sigma, and FMEA methodologies to improve process capability, yield, cycle time, equipment uptime, and manufacturing efficiency.
Technology leader responsible for driving Co-Packaged Optics (CPO) and Silicon Photonics technology development from concept to high-volume manufacturing.
Responsibilities
Work with product architects and Silicon Photonics technology teams to define optical engine architectures, package architectures, and long-term technology roadmaps.
Drive Silicon Photonics technology development from wafer process integration through packaging, qualification, and production deployment.
Partner with foundries to develop and optimize Silicon Photonics manufacturing processes, yield strategies, and technology qualification plans.
Design multi-fiber optical connectors and work with ecosystem partners to establish scalable optical connectivity solutions.
Enable new package technology development initiatives including 2.5D, 3D, hybrid bonding, and optical packaging technologies from concept to full qualification.
Lead end-to-end NPI-to-HVM industrialization of advanced packages across external OSAT and foundry partners
Coordinate ramp plans, risk mitigation, and readiness reviews to ensure stable yield and predictable scale-up
Support ongoing manufacturing and operations, and lead sustaining engineering to maintain stable yield, quality, and delivery in high-volume production
Serve as the primary interface between package design, technology development, and external partners to ensure manufacturable package architectures
Drive end-to-end DFM integration, identifying and closing manufacturability and technology-to-manufacturing gaps early
Requirements
Bachelor’s or master’s degree in mechanical engineering
Bachelor’s or master’s degree in materials science
Bachelor’s or master’s degree in electrical engineering
Bachelor’s or master’s degree in chemical engineering
Bachelor’s or master’s degree in a related engineering discipline
Bachelor's degree in Mechanical Engineering, Industrial Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Manufacturing Engineering, or a related technical discipline
Associate's degree in a related technical discipline
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