Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Compensation
Summary pay range: $146,200 - $197,800
Responsibilities
Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Active U.S. Top Secret/SCI Security Clearance
Nice to have: Experience within aerospace or related industry or with space electronics
Nice to have: Experience with ANSYS analysis, Creo CAD, SolidWorks, Finite Element Analysis (FEA), Siemens NX Nastran, MSC Patran, COMSOL Multiphysics
Nice to have: 3+ years of experience leading teams on complex projects
Design and analyze space electronics packaging and mechanical components for satellite missions, performing structural, thermal, and vibration analysis, and collaborating with multi-discipline teams.
Compensation
Summary Pay Range (Associate - Level 2): $98,600- $133,400
Summary Pay Range (Mid-Level - Level 3): $119,850- $162,150
Responsibilities
Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Mid-Level (Level 3): 5+ years of related work experience or an equivalent combination of technical education and experience
Entry-Level Mechanical Product Design and Analysis Engineer
Design and analyze mechanical products for space electronics packaging, including PCB layout, thermal and structural analysis, and integration with electrical systems.
Compensation
Summary pay range: $79,050 - $106,950
Responsibilities
Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (Electrical, Mechanical or Aeronautical)
Simulation engineer for thermal and structural analysis for compact, high-density consumer electronics such as smart wearables using CFD and FEA.
Responsibilities
Build and run conjugate heat transfer (CHT) simulations at system, board and component level, including natural convection, forced convection and radiation.
Model the thermal behavior of SoCs, PMICs, batteries, displays, cameras and other heat-dissipating parts in tight enclosures.
Run transient analyses of power profiles and use cases and support thermal throttling and power budget strategy.
Lead thermal and CFD modeling for complex engineering problems involving high-temperature heat transfer, combustion, fluid flow, and transport phenomena.
Responsibilities
Lead thermal and CFD modeling for complex engineering problems
Use simulation to understand system behavior, troubleshoot problems, evaluate design and operating changes, and identify opportunities to improve performance
Develop and validate models using experimental and operating data
Use parametric studies, design of experiments, optimization, reduced-order models, and surrogate models
Use Python, workflow automation, and AI/ML methods to reduce repetitive simulation work
CFD/FEA Senior Engineer - Electronics Thermal ManagementQuest Global · Thiruvananthapuram, India
Sr Thermal & Fluids EngineerOwens Corning · Granville, US