- Thiruvananthapuram, Kerala, India
- On-site
- Full-time · Senior
Simulation engineer for thermal and structural analysis for compact, high-density consumer electronics such as smart wearables using CFD and FEA.
Responsibilities
- Build and run conjugate heat transfer (CHT) simulations at system, board and component level, including natural convection, forced convection and radiation.
- Model the thermal behavior of SoCs, PMICs, batteries, displays, cameras and other heat-dissipating parts in tight enclosures.
- Run transient analyses of power profiles and use cases and support thermal throttling and power budget strategy.
- Evaluate cooling solutions: heat spreaders, graphite sheets, vapor chambers, TIMs, phase-change materials and airflow paths.
- Run thermo-mechanical stress and warpage analysis on PCBs, solder joints, packages and enclosures.
Requirements
- B.E.
- B.Tech
- M.Tech
- M.S.
- Mechanical Engineering