Designing and defining cutting-edge mechanical and electro-mechanical systems for Lam's etch and deposition products, involving feasibility studies, testing, and detailed design and fabrication.
Responsibilities
Participates in and often leads the conceptualization, modeling, analysis, development, documentation, and test/validation of hardware associated with new semiconductor equipment
Designs parts using metals, ceramics, quartz, plastics, and advanced coatings/plating’s
Ensures documentation is consistent with SEMI, Lam Standards and other standards as applicable (ANSI, DIN etc.)
Performs analytical work to characterize and properly specify new and existing designs, including heat transfer, stress, vibrations, fluid/gas dynamics and manufacturability
Develops and execute test plans that generate characterization data sufficient to understand and validate the performance of the design
Requirements
Bachelor’s degree in Mechanical Engineering or related field
Master’s degree in Mechanical Engineering or related field
Nice to have: Semiconductor industry experience
Nice to have: Optics and optic systems design experience
Nice to have: Mechanical, electrical, or test systems design experience
EV Mechanical Design Engineer to join the Current Product Vehicle Engineering team, supporting vehicles in the field, troubleshooting issues, and contributing to the design and development of motorcycle mechanical systems.
Compensation
Pay Range: $74,900 - $112,200
Responsibilities
Work on every part of the motorcycle
Identify and address opportunities for full vehicle technical continuous improvement
Conduct root cause analysis on field concerns using analytical engineering problem solving tools
Deliver significant influence on warranty performance
Provide direct engineering support for continuity of production (Manufacturing plant support)
Requirements
Bachelor of Science Degree in Mechanical Engineering, or relevant related technical discipline
Nice to have: Hands-on bench and vehicle testing experience
This candidate will work as part of the CHS global mechanical engineering team. Responsibilities include the mechanical design of electro-mechanical enclosures including server rack platforms, outdoor cabinet enclosures, IOT, fixtures, and consumer mobile device test platforms.
Compensation
$99,500.00 - $149,300.00
Responsibilities
Design and develop detailed electro-mechanical test fixtures, and development platforms
Create detailed mechanical design, including 3D CAD models, assemblies, and manufacturing drawings
Electromechanical chassis and rack design of server test and production platforms
Create necessary documentation for sourcing, assembling, and sustaining assembly BOMs
Coordinating/sourcing prototype and production plastic, sheet metal, 3D printed, die-cast, and CNC machined mechanical assembly components including housings, heatsinks, cables, fixtures, chassis, etc.
Requirements
BSME (Bachelors - Mechanical Engineering)
Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field
Nice to have: 3D solid modelling design tools experience utilizing CREO, Solid works, or equivalent platforms
Nice to have: design experience with plastic injection molded, die cast, chassis sheet metal, and CNC machined parts
Nice to have: experience developing mechanical constraints for printed circuit board assemblies
Mechanical Engineer at Lam Research designing and developing mechanical and electro-mechanical systems for semiconductor equipment.
Responsibilities
Participates in and leads conceptualization, modeling, analysis, development, documentation, and test/validation of hardware associated with new semiconductor equipment.
Designs parts using metals, ceramics, quartz, plastics, and advanced coatings/plating’s.
Works with suppliers to ensure parts can be manufactured in accordance with performance and cost objectives.
Ensures documentation is consistent with SEMI, Lam Standards and other standards such as ANSI, DIN, GD&T.
Performs analytical work to characterize and specify new and existing designs, including heat transfer, stress, vibrations, fluid/gas dynamics and manufacturability.
Requirements
Bachelor's degree in Mechanical Engineering or related field
Design and develop thermal and acoustic solutions for HP high-performance workstations, influencing system architecture, fan-control strategy, and reliability from concept to market.
Compensation
The pay range for this role is $93,400 to $143,800 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Responsibilities
Develop and integrate thermal and acoustic solutions that balance compute performance, acoustics, reliability, cost, and schedule.
Evaluate emerging thermal-management and fan-control technologies and translate promising approaches into system-level designs.
Develop and execute validation plans, analyze results, and use findings to improve thermal, fan-control, acoustic, and reliability performance.
Work with internal teams and external development partners to communicate evidence, resolve trade-offs, and align on design decisions and system requirements.
Influence thermal architecture roadmaps and deliver solutions within project scope and budget requirements.
Requirements
Bachelor’s or master’s degree in mechanical engineering or a closely related engineering discipline
The pay range for this role is $93,400 to $143,800 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Responsibilities
Design Excellence: Develop and integrate thermal and acoustic solutions that balance compute performance, acoustics, reliability, cost, and schedule.
Thermal Expertise: Evaluate emerging thermal-management and fan-control technologies and translate promising approaches into system-level designs.
Performance Optimization: Develop and execute validation plans, analyze results, and use the findings to improve thermal, fan-control, acoustic, and reliability performance.
Expert Collaboration: Work with internal teams and external development partners to communicate evidence, resolve trade-offs, and align on design decisions and system requirements.
Strategic Planning: Influence thermal architecture roadmaps and deliver solutions within project scope and budget requirements.
Requirements
Bachelor’s or master’s degree in mechanical engineering or a closely related engineering discipline
The pay range for this role is $93,400 to $143,800 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Responsibilities
Design Excellence: Develop and integrate thermal and acoustic solutions that balance compute performance, acoustics, reliability, cost, and schedule.
Thermal Expertise: Evaluate emerging thermal-management and fan-control technologies and translate promising approaches into system-level designs.
Performance Optimization: Develop and execute validation plans, analyze results, and use the findings to improve thermal, fan-control, acoustic, and reliability performance.
Expert Collaboration: Work with internal teams and external development partners to communicate evidence, resolve trade-offs, and align on design decisions and system requirements.
Strategic Planning: Influence thermal architecture roadmaps and deliver solutions within project scope and budget requirements.
Requirements
Bachelor’s or master’s degree in mechanical engineering or a closely related engineering discipline
Mechanical Engineer responsible for design, development, and sustainment of mechanical systems for semiconductor capital equipment.
Responsibilities
Own the design, development, qualification, and sustainment of mechanical systems, modules, and subsystems for Semiconductor Capital Equipment throughout the product lifecycle.
Drive technical decisions, architecture trade-offs, and innovative design solutions to meet performance, reliability, safety, cost, schedule, and DFX objectives.
Lead complex engineering problem-solving, root cause investigations, risk assessments, and implementation of corrective actions.
Develop solutions for Thermal Management, Cooling Systems, Utility Integration, and other critical subsystem requirements.
Collaborate with Systems, Electrical, Manufacturing, Supplier Engineering, and global engineering teams to deliver robust, scalable, and manufacturable designs.
Requirements
Bachelor's degree in Mechanical Engineering or related discipline
Nice to have: Master's degree in Mechanical Engineering or related discipline
Nice to have: Semiconductor Equipment Manufacturing
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