- California, United States
- On-site
- 10+ years
Lead definition, development, and qualification of advanced 2.5D and 3D packaging technologies for future Apple products.
Lead the physical design implementation and strategy for high-performance silicon, managing end-to-end execution from RTL to GDSII and driving cross-functional collaboration.
US: $192000 - $278000 (USD) + 20% bonus target + equity + benefits