Senior technical authority responsible for defining, optimizing, and sustaining end-to-end process integration flows for probe card manufacturing in a high-volume semiconductor environment.
Compensation
$163,400.00 - $214,410.00 per year
Responsibilities
Define, own, and continuously improve end-to-end process integration flows for probe card manufacturing
Ensure alignment of unit process performance to product-level electrical, mechanical, and reliability targets
Identify and manage integration risks, interactions, and trade-offs across modules
Lead integration-level yield improvement initiatives using data-driven analysis
Investigate complex yield excursions, defect mechanisms, and cross-process interactions
The Warranty Quality Technician will support the Warranty Return Center by inspecting Transmission and Electronics parts, focusing on warranty quality. Additional duties include reviewing warranty processes, reporting QA metrics, and delivering training based on quality analysis.
Compensation
The expected annual salary range for this role is $69000 - $101000 a year
Responsibilities
Participate in the implementation and audit of each of the EBS elements (safety, housekeeping, 5S, VSM, and EHS (MESH)) policies and procedures.
Participate in daily and monthly inspections and audits.
Perform QA Audit work on Warranty Claims and Warranty Inspections capturing opportunities for improvement and alignment with warranty standards.
Assist with reporting out metrics, provide training and process improvements to address opportunities identified from QA.
Administer warranty policies and procedures supporting the adjudication for each product and customer with respect to the warranty return center responsibilities.
Electrical Failure Analysis Engineer in Texas Instruments’ Lehi Fab, responsible for diagnosing and isolating electrical failures in semiconductor devices.
Responsibilities
Perform bench level electrical verification and advanced fault isolation on integrated circuits
Analyze failure mechanisms using ATPG-generated test vectors and scan diagnostics
Interpret schematic diagrams, layouts and written descriptions to conduct testing and troubleshooting
Write detailed failure analysis reports
Manage failure analysis process and develop skill set
Requirements
Master's Degree in Electrical Engineering
Nice to have: Strong verbal and written communication
As a Product Engineer working directly in support of the NAND Product Development Team Leader, your role involves collaborating with cross-functional teams to propel new product development and spearhead the integration of AI solutions into actionable strategies and plans.
Responsibilities
Define and implement NAND Flash reliability test flows to assess product reliability performance and prevent extrinsic/intrinsic reliability escapes.
Perform high-volume statistical data analysis to evaluate NAND DPM/ intrinsic reliability risks and trends.
Drive electrical failure analysis, including advance characterization, to identify root causes and solution spaces.
Develop short-term countermeasures such as targeted stresses and screens, applying knowledge of digital/analog circuits, device physics, and process engineering.
Qualify the product with innovative control measures to provide best in Class DPM and Cell reliability.
Product Engineer supporting the NAND Product Development Team Leader, driving new product development and AI integration.
Responsibilities
Define and implement NAND Flash reliability test flows to assess product reliability performance and prevent extrinsic/intrinsic reliability escapes.
Perform high‑volume statistical data analysis to evaluate NAND DPM/ intrinsic reliability risks and trends.
Drive electrical failure analysis, including advance characterization, to identify root causes and solution spaces.
Develop short‑term countermeasures such as targeted stresses and screens, applying knowledge of digital/analog circuits, device physics, and process engineering.
Qualify the product with innovative control measures to provide best in Class DPM and Cell reliability.
Requirements
Bachelor's degree in Electrical Engineering or related field
Master's degree in Electrical Engineering or related field
Lead failure analysis for next‑generation HBM devices, applying electrical, physical, and statistical techniques to identify root causes and drive corrective actions.
Responsibilities
Perform electrical, physical, and statistical failure analysis to identify, characterize, and understand defect and failure mechanisms in HBM products.
Analyze component- and system-level data to resolve root causes of failures using statistical techniques, engineering methodologies, and AI-enabled tools.
Apply AI tools (e.g., Copilot, Claude) and improved analytics to enhance failure detection, reliability learning cycles, yield improvement, and component performance.
Work closely with Product, Process, Test, Quality, and Manufacturing Engineering teams to resolve fabrication, assembly, and test-related issues.
Identify process defects, assembly-related failures, and test flow marginalities through detailed data analysis and characterization.
Requirements
Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field.
Nice to have: 7+ years of experience performing electrical and statistical failure analysis in the semiconductor industry
Nice to have: 7+ years of experience applying electrical and physical characterization techniques for semiconductor device and component analysis
Nice to have: Advanced coursework or hands-on experience in VLSI design, semiconductor processes, device physics, Python, and applied statistics
HBM PYE Product Development Failure Analysis Engineer
As part of the HBM Product Development Failure Analysis (PDFA) team, you will play a meaningful role in bringing next-generation HBM products from design through qualification and into high production manufacturing, focusing on product reliability and yield improvement.
Responsibilities
Perform electrical, physical, and statistical failure analysis to identify, characterize, and understand defect and failure mechanisms in HBM products.
Analyze component- and system-level data to resolve root causes of failures using statistical techniques, engineering methodologies, and AI-enabled tools.
Apply AI tools (e.g., Copilot, Claude) and improved analytics to enhance failure detection, reliability learning cycles, yield improvement, and component performance.
Work closely with Product, Process, Test, Quality, and Manufacturing Engineering teams to resolve fabrication, assembly, and test-related issues.
Identify process defects, assembly-related failures, and test flow marginalities through detailed data analysis and characterization.
Nice to have: Experience using Artificial Intelligence or Generative AI tools (e.g., Copilot, Claude) for large-scale data analysis, failure prediction, and root cause identification
Career Accelerator Program - Failure Analysis Engineer - MS/PhD - Lehi, UTTexas Instruments · Lehi, US
Engineer - STPG PE NANDMicron Technology · Singapore, Singapore