Thermal Engineering leads and delivers the development of innovative and compliant mechanical design solutions, as well as cross-functional interfaces for Networking Switch Products and Peripherals including 25G, 100G, 400G, 800G and 1.6T Switch Products.
Responsibilities
Lead efforts of internal and external thermal development teams in all development project activities
Take charge of thermal development activities with cross-functional teams on the AI Data Center and Campus switches and components and provides design guidance and solutions for difficult thermal issues
Supports and influences integration of thermal strategy across technical disciplines internally and externally
Generates new process and specification to meet the newly developed technology trends, including AI Data Center Switch strategy
Innovate patents to protect our core value and win the product competition
Thermal Engineering leads and delivers the development of innovative and compliant mechanical design solutions, as well as cross-functional interfaces for Networking Switch Products and Peripheralsincluding 25G, 100G, 400G, 800G and 1.6T Switch Products.
Responsibilities
Lead efforts of internal and external thermal development teams in all development project activities
Take charge of thermal development activities with cross-functional teams on the AI Data Center and Campus switches and components and provides design guidance and solutions for difficult thermal issues
Supports and influences integration of thermal strategy across technical disciplines internally and externally
Directs across products, technical disciplines and core teams on all thermal issues
Drive optimized performance between thermal requirement and acoustic requirement to deliver best customer experience
Thermal Engineering leads and delivers the development of innovative and compliant mechanical design solutions, as well as cross-functional interfaces for Networking Switch Products and Peripheralsincluding 25G, 100G, 400G, 800G and 1.6T Switch Products.
Responsibilities
Lead efforts of internal and external thermal development teams in all development project activities
Take charge of thermal development activities with cross-functional teams on the AI Data Center and Campus switches and components and provides design guidance and solutions for difficult thermal issues
Supports and influences integration of thermal strategy across technical disciplines internally and externally
Directs across products, technical disciplines and core teams on all thermal issues
Drive optimized performance between thermal requirement and acoustic requirement to deliver best customer experience
Responsible for detailed thermal analysis on products throughout their lifecycle from initial design trade studies and proposals through qualification testing to enduring production support.
Compensation
The salary range for this role is 132,400 USD - 251,600 USD.
Responsibilities
Perform Hand Calculations to determine scope of higher detail analysis models
Generate test plans required to validate analyses and verify hardware compliance to customer requirements
Analyze test data to validate and correlate models
Review your work with peers to ensure technical accuracy
Present results to internal, external, and government customers
Requirements
Degree in Science, Technology, Engineering or Mathematics (STEM)
Advanced Degree in a related field
Nice to have: Mechanical Engineering
Nice to have: Aerospace Engineering
Nice to have: Solid modeling CAD tools (CREO or equivalent)
Lead the end-to-end thermal design, simulation, optimization, and physical validation of Direct-to-Chip liquid cooling solutions for next-generation AI accelerators and high-density compute platforms.
Compensation
The annual base salary range for this position is USD To USD
Responsibilities
Build and run detailed CFD and thermal-resistance network models
Research advanced cooling technologies and develop integration and test plans
Co-design high-performance liquid cold plates
Specify, select, and qualify thermal interface materials
Design coolant flow paths and related mechanisms
Requirements
Bachelor’s or Master’s degree in Mechanical or Thermal Engineering (M.S. preferred)
Own your thermal hardware end to end: design, development, test, release and delivery for next-generation hardware for AI data center networking.
Compensation
The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.
Responsibilities
Own thermal components and subsystems from concept to production
Design and develop thermal hardware for liquid-cooled systems, including cold plates, coolant loop components and thermal interfaces
Run thermal and CFD analysis to validate designs and support design decisions
Build and execute test plans: thermal test vehicles, flow and pressure-drop testing, thermal resistance measurement and reliability testing
Correlate test results to models and drive design fixes to closure
Requirements
BS in Mechanical Engineering or related field
MS in heat transfer or fluid mechanics
PhD in heat transfer or fluid mechanics
Nice to have: High-performance TIMs qualification
Nice to have: Thermal design for high-power packages (AI/HPC accelerators)
Internship work on technology that is changing how AI systems are built, focusing on packaging thermal and mechanical analysis.
Compensation
Hourly Rate in USD
$53—$57 USD
Responsibilities
Build a flexible framework that links package design parameters to outputs such as thermal performance and warpage.
Develop and evaluate PINNs, other surrogate models, and reduced-order or analytical models for fast first-order predictions on new package concepts.
Automate FEA and CFD setup, execution, and post-processing in Python to generate parametric datasets. Train and validate models against high-fidelity simulation and hardware data, quantifying accuracy and uncertainty.
Plan and run physical DOEs (test setup, measurement, analysis) to build understanding of coupled thermal-structural-optical physics.
Partner with packaging, thermal, and thermo-mechanical engineers to define requirements and inputs/outputs, and adapt the framework to upcoming products.
Requirements
MS or PhD in Mechanical Engineering or a related field
Nice to have: graduate research in electronic or semiconductor packaging
Lead the development and qualification of advanced thermal solutions for next-generation server and rack infrastructure deployed in cloud and AI-driven data centers.
Responsibilities
Develop, design, and qualify thermal solutions for rack and server infrastructure supporting cloud data centers, including compute, storage, and GPU platforms.
Own server- and rack-level thermal architecture from concept through design validation, qualification, and production readiness.
Design and optimize thermal management solutions utilizing both air-cooling and liquid-cooling technologies.
Perform Computational Fluid Dynamics (CFD) simulations using ANSYS Icepak, FloTHERM, or equivalent tools to evaluate airflow, pressure, heat distribution, component temperatures, and overall system performance.
Optimize airflow, fan performance, acoustics, thermal margins, and energy efficiency at system and rack levels.
Requirements
Bachelor's degree in Mechanical Engineering, Thermal Engineering, or a related engineering discipline
Nice to have: Master's degree in Mechanical Engineering, Thermal Engineering, or a related technical field
Nice to have: Experience designing and qualifying liquid cooling solutions for high-density server, AI, or HPC deployments
Nice to have: Experience supporting rack-level thermal solutions for cloud, hyperscale, or enterprise data center environments
Nice to have: Familiarity with GPU-intensive platforms and thermal considerations for AI and accelerated computing workloads
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