Lead bench characterization, system-level validation, and technical customer enablement for advanced Smart Power Stages and controllers in AI data center architectures.
Responsibilities
Lead hands‑on lab characterization, debugging, and performance optimization of Smart Power Stages, driver ICs, and multiphase controllers under real‑world AI workload dynamics.
Evaluate and benchmark high‑frequency, high‑power density Si and GaN‑based power stages, optimizing for power density, transient response, efficiency, and thermal dynamics.
Partner closely with IC Design, Package Engineering, Systems Engineering, and Product/Test teams to translate system requirements into silicon/module definitions and resolve complex silicon and packaging anomalies.
Provide application‑level feedback on advanced power packaging technologies, including QFN, LGA, Fan‑Out Panel Level Packaging (FO‑PLP), and Chip‑Embedded / substrate‑embedded architectures.
Deliver reference designs, evaluation boards (EVBs), application notes, and direct engineering support to top‑tier hyperscale and server OEM/ODM hardware teams.
Requirements
B.S. in Electrical Engineering (M.S. or Ph.D. preferred with a focus on Power Electronics)
Own the number: Drive double-digit revenue growth on an >$80M business, push WIN% to >60%, and deliver +35% YoY new business wins. Build a market from scratch: Lead the SoC war board to accelerate growth in IVI and ADAS, and build direct relationships with the SoC ecosystem players who will define the next decade of automotive compute. Launch new frontiers: Identify and scale opportunities in the emerging Functional Safety portfolio and the fast-growing, competitive Modules space. Shape the field: Drive connections across TI’s EMEA field organization, develop compelling collateral, and track reference designs, key accounts, and new business wins from concept to close.
Responsibilities
Convert design-ins to design-wins (DINs → DWINs)
Build and maintain close relationships with top-tier customers and TI account managers to surface opportunities early
Craft product positioning and messaging that sets TI apart
Own the full product lifecycle marketing plan – pre-RTM, at-RTM, and post-RTM
Analyze the competitive landscape and build strategies that close gaps and open new ones for TI
Develop and execute reliability characterization strategies for advanced power semiconductor products, including accelerated life testing and failure analysis.
Compensation
The expected annual pay range for this position is $138-173K.
Responsibilities
Develop and execute reliability characterization strategies
Establish acceleration models
Translate accelerated test results to application mission profiles
Support qualification of products for industrial and automotive applications
Design experiments to identify and characterize semiconductor failure modes
Lead electronics development for space and terrestrial robotics, designing analog, digital, and power circuits, prototyping, testing, and integrating into missions.
Compensation
$115,544 - $138,008
Responsibilities
Own technical development of electronics, including specification, architecture, simulation, PCB design, laboratory testing, and mission infusion
Design analog, digital, and power electronics circuits for space and terrestrial robotics
Identify candidate technologies, design test fixtures, and support heavy ion testing to evaluate new parts for radiation effects
Collaborate with JPLers across disciplines to integrate your designs into complex robotic missions and instrument systems
Dream up and propose new projects to solve the hardest problems in space and on earth
Requirements
Bachelor’s degree in electrical engineering, robotics engineering, or similar technical discipline
Master’s degree in a similar discipline
Ph.D. in a similar discipline
Nice to have: lead new hardware projects
Nice to have: propose new electronics projects and win funding
Research Intern in Computer Vision and Machine Learning
Compensation
🏡 Hybrid work
🏝 Mandatory internship agreement from your school (1 day off per month)
💻 MacBook ou PC
🍜 60% coverage of meal vouchers worth €9 per day worked
🚃 50% Navigo pass reimbursement
💼 Offices located in central Paris (9th arrondissement)
☀️ Annual offsite with the whole team and plenty of company events
Responsibilities
Implement pixel-level baselines and low frame rate tracking
Design an object-centric scene memory
Target cases from Vizzia's field use
Characterise failure modes by observation rate, history length, day/night and weather
Evaluate on events rather than frames
Requirements
Master's degree (M2) in Computer Vision, Machine Learning or Applied Mathematics
Lead system architecture design and development for energy generation, storage, and conversion solutions, integrating power electronics, grid connectivity, and renewable technologies.
Responsibilities
Define complete energy system architectures including grid connection and protection schemes (MV/LV).
Architect AC/DC and DC/DC power conversion systems including PFC, LLC, PSFB and bidirectional topologies.
Define Battery Energy Storage Systems (BESS), BMS architectures and microgrid solutions.
Design distributed energy systems integrating solar PV, wind, fuel cells and renewable sources.
Define architectures for distribution automation, substation monitoring, protection systems, power quality and DER integration.
Lead system architecture design for energy generation, storage, and conversion solutions, integrating power electronics, grid connectivity, and renewable sources.
Responsibilities
Define complete energy system architectures including grid connection and protection schemes (MV/LV).
Architect AC/DC and DC/DC power conversion systems including PFC, LLC, PSFB and bidirectional topologies.
Define Battery Energy Storage Systems (BESS), BMS architectures and microgrid solutions.
Design distributed energy systems integrating solar PV, wind, fuel cells and renewable sources.
Define architectures for distribution automation, substation monitoring, protection systems, power quality and DER integration.
Provide technical support and expertise to customers for Infineon power semiconductor products, secure design‑in/win, and develop new business opportunities.
Responsibilities
Secure design‑in/win for industrial power semiconductor by working with Sales, Marketing and System/Product Application Engineer
Provide extensive technical support and engage internal experts for second‑level support when needed
Provide technical support and expertise to customers, assisting with product selection, resolving technical issues, and developing new business opportunities
Build and maintain strong relationships with customers, understanding their needs and requirements
Work effectively with internal teams, such as engineering, sales, and marketing, to ensure customer satisfaction and business success
Requirements
Bachelor’s Degree or above in Electronics / Electrical Engineering
Provide technical support and expertise to customers for Infineon power semiconductor products, secure design‑in/win, conduct training, and develop new business opportunities.
Responsibilities
Secure design‑in/win for industrial power semiconductor products
Provide extensive technical support and engage internal experts for second‑level support
Assist customers with product selection and resolve technical issues
Build and maintain strong customer relationships
Work with internal teams to ensure customer satisfaction
Requirements
Bachelor’s Degree in Electronics or Electrical Engineering
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Research InternVizzia · Paris, France