Join the Advanced Technology Development team to lead mechanical architecture and design for rapid radar prototypes, electronics packaging, thermal solutions, test infrastructure, and early system integration.
Compensation
The expected annual salary range for this role is $149,659—$224,437 USD
Responsibilities
Lead mechanical development for prototypes, testbeds, demonstrators, and future Advanced Technology Development efforts
Develop electronics packaging, enclosure, radome, mounting, handling, and installation concepts for advanced radar hardware
Design thermal solutions for RF assemblies, high-power electronics, compute hardware, and compact radar configurations
Collaborate with RF, electrical, PCB design, systems, test engineering, manufacturing, suppliers, and key stakeholders to deliver mission-critical prototype solutions within demanding performance and timeline goals
Create parts, assemblies, fixtures, and integration hardware using rapid machining, sheet metal, additive manufacturing, and quick-turn supplier capabilities
Requirements
BS in Mechanical Engineering or a related technical field
Nice to have: Mechanical hardware design for radar
Nice to have: Mechanical hardware design for phased arrays
Nice to have: Mechanical hardware design for aerospace
Nice to have: Mechanical hardware design for defense
New Technologies & Electronics Engineer responsible for integration, validation, and documentation of new vehicle technologies for bus chassis.
Responsibilities
Support research, technical-economic assessment, integration, validation, documentation, and project execution of new technologies for bus chassis
Evaluate and integrate new vehicle technologies with technical ownership of electronic modules, ECU parameterization, flashing, and E/E architecture interfaces
Define communication, power-supply, diagnostic, and configuration requirements; manage software/parameter versions and ensure configuration traceability
Support connected vehicle, telematics/ITS, hybrid/electric, energy-recovery, and other advanced technology projects from feasibility through vehicle integration
Plan and execute integration, installation, commissioning, flashing, and parameterization of electronic modules and new technologies on engineering prototypes
Developing and sustaining the electrical infrastructure of advanced semiconductor metrology and inspection equipment, focusing on machine-level electrical integration, cable and harness architecture, power distribution, safety circuits, compliance, and PCB layout coordination.
Compensation
Base Salary Range: $115,200.00 - $172,800.00, offered in good faith and based on experience, location, and qualifications. Additional Rewards: Annual bonus opportunities and potential long-term incentives tied to both company and individual success.
Responsibilities
Lead the electrical design and integration of semiconductor capital equipment and complex machine subsystems.
Develop machine-level cable, harness, and interconnect architectures, including connector selection, pin assignments, shielding, grounding, strain relief, service loops, bend radii, and routing constraints.
Create and maintain cable diagrams, wiring schematics, interconnect drawings, cable schedules, bills of material, and installation documentation.
Develop system power budgets and power-distribution architectures, including load analysis, voltage-drop calculations, protection, power sequencing, inrush-current considerations, and thermal derating.
Design and validate safety circuits, interlocks, emergency-stop chains, protective functions, and related diagnostic coverage in collaboration with systems and safety stakeholders.
