Chiplet integration jobs

Senior Integration Lead - Advanced Packaging 3DHi and 2.5D

GlobalFoundries · Posted Nov 6, 2026

Open

Singapore, Singapore
On-site
Full-time · Senior
5+ years

Senior Integration Lead - Advanced Packaging 3DHi and 2.5D

GlobalFoundries · Posted Nov 6, 2026

Open

Singapore, Singapore
On-site
Full-time · Senior
5+ years

Senior Integration Lead - Advanced Packaging 3DHi and 2.5D

GlobalFoundries · Posted Nov 6, 2026

Open

Singapore
Senior
5+ years

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Lead integration of advanced packaging technologies in Singapore, driving architecture, qualification, and manufacturing readiness.

Responsibilities

Serve as lead integrator for 3DHi and 2.5D technology development programs
Define and integrate end-to-end process flows for chiplet-based 2.5D and 3DHi solutions
Own integration trade‑off analysis across performance, reliability, yield, and manufacturability
Define test‑site requirements and lead development of test structures and vehicles
Establish process‑control, inspection, metrology, defectivity, and qualification strategies

Requirements

Bachelor’s degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field
Nice to have: Advanced degree in a relevant engineering or science discipline
Nice to have: Experience in Singapore’s semiconductor ecosystem
Nice to have: Established working relationships with Singapore‑based research institutes, universities, OSATs, equipment suppliers, materials vendors, or other advanced packaging partners
Nice to have: Working knowledge of 2.5D/3D design enablement and co‑design considerations

Skills

3DHi 2.5D

Senior NPI Engineer

Micron Technology · Posted Nov 4, 2026

Open

Singapore, Singapore
Senior
3+ years

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Lead all aspects of the full lifecycle of APTD programs, including planning, execution, monitoring, and closure, and manage cross‑functional teams across APTD, PDE, CPI, and NPI to ensure timely, high‑quality delivery of critical initiatives.

Responsibilities

Lead all aspects of the full lifecycle of APTD programs
Define program objectives, deliverables, resource plans, and success metrics
Lead cross‑functional teams across APTD, PDE, CPI, and NPI
Develop and implement standardized PMO methodologies, tools, and templates
Lead CapEx and OpEx planning, PTM and MOR processes, and integrate BOP design systems

Requirements

Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical field

Skills

semiconductor packaging process integration technology development advanced packaging flows hybrid bonding CoWoS chiplet integration

Senior NPI Engineer

Micron Technology · Posted Nov 4, 2026

Open

Singapore, Singapore
On-site
Full-time · Senior
3+ years

Apply with RefersoAI Apply on careers page

Senior NPI Engineer responsible for the full lifecycle of APTD programs, including planning, execution, and cross-functional leadership to ensure high-quality delivery delivery.

Responsibilities

Lead all aspects of the full lifecycle of APTD programs, including planning, execution, monitoring, and closure.
Define program objectives, deliverables, resource plans, and success metrics.
Lead cross-functional teams across APTD, PDE, CPI, and NPI to ensure timely, high-quality delivery of critical initiatives.
Develop and implement standardized PMO methodologies, tools, and templates.
Lead CapEx and OpEx planning, PTM and MOR processes, and integrate BOP design systems.

Requirements

Bachelor’s degree in Engineering
Master’s degree in Engineering
Bachelor’s degree in Materials Science
Master’s degree in Materials Science

Skills

semiconductor packaging process integration technology development advanced packaging flows hybrid bonding