The candidate will work in a team of engineers to develop power products for Data Center Market, focusing on high-performance power solutions for AI computing, cloud infrastructure, and intelligence-edge systems.
Responsibilities
Develop proof of concept simulation models and correlate with bench performance
Generation and validation reference designs for system verification and customer applications
Support Troubleshooting of difficult or unusual technical problems
Writing circuit documentation and application notes
Product promotion in front of customers and business development
Design innovative power supply products for datacenters, industrial and telecommunication applications and lead the product development process from concept to high volume production.
Responsibilities
Selecting AC/DC and DC/DC topologies based on product requirements
Designing controllers for AC/DC and isolated DC/DC converters
Optimizing designs for efficiency, density, and cost
Creating schematics, bills of material, and PCB layouts
Creating high density PCB layout with noise and EMI mitigation
Requirements
Bachelor of Science Degree in Electrical Engineering / Power Electronics or equivalent
Nice to have: Master of Science degree in Electrical Engineering / Power Electronics
Nice to have: Grid‑interfaced power converter control design
HBM Design Architect responsible for first-principles architecture analysis, simulation, and modeling for high-bandwidth memory products.
Responsibilities
Perform architecture-level analysis for HBM/DRAM products, including dynamic and static power, PDN/IR drop, thermal behavior, timing, and area trade-offs
Build first-principles models and contributor breakdowns (array, periphery, datapath, I/O, TSV) and correlate them with simulation and silicon data
Set up and run circuit simulations (SPICE/HSPICE, FineSim, PrimeSim, Spectre, or equivalent) and associated CAD flows — schematic setup, parasitic extraction, and post-layout simulation — to validate architectural assumptions
Assess the impact of new technologies on product metrics, including advanced DRAM nodes, 3D stacking, scaled-pitch hybrid bonding, and BEOL/TSV changes
Partner with circuit designers, process technologists, and packaging engineers to develop and quantify architectural solutions
Requirements
Bachelor of Science in Electrical Engineering or related field
Master of Science or PhD with 0–2+ years of relevant experience
Lead the design and delivery of high‑precision electronic circuits for Renishaw’s Coordinate Measuring Machine and Gauging Product Division.
Compensation
Up to £55,000 depending on experience
Responsibilities
Work with project and product managers to define product specifications.
Be responsible for the design and delivery of electronic circuits to meet the agreed specifications.
Work closely with software and mechanical engineers to optimise system engineering.
Liaise with process development and production colleagues to ensure designs are suitable for transfer to production, considering design for assembly and test.
Understand EMC regulations and carry out EMC compliance testing.
A 2-year graduate programme focused on growth as a Hardware Engineer within the Cyber business unit, working on advanced embedded encryption solutions.
Responsibilities
Contribute to the creation of electronics requirements, architecture, and design documentation
Develop block diagrams and schematics for digital and analogue electronics required for product development
Select optimum components that meet the requirements
Perform design calculations and carry out simulations in order to estimate performance
Participate in the building of prototypes and identify problem areas
Requirements
Degree in Electronics Engineering or closely related discipline
Nice to have: Masters in Electronic Engineering
Nice to have: PCB layout knowledge
Nice to have: Testing of electronic circuits using standard lab equipment
Nice to have: Thermal analysis of electronic components
New College Grad - HBM Design ArchitectMicron Technology · Richardson, US