Layout components and route electrical conductors for complex PCBs and flex circuits
Interface with electrical and mechanical engineers to work through component placement, routing, mechanical fitment for rigid, flex, and rigid‑flex assemblies
Design to electrical requirements, mechanical outlines, for producibility and manufacturability
Calculate layer stack‑up based on industry standards, supplier capabilities, and engineering requirements
Generate drawings for the bare PWB and assembled CCA levels, as well as their corresponding part lists
Requirements
Bachelor's degree in STEM field
Master's degree in STEM field
PhD in STEM field
Nice to have: Advanced degree in STEM field
Nice to have: Active US Government Secret security clearance
This part time position supports the Milan Ohio office, focusing on thermal analysis for advanced fluids, spacecraft components, and rocket engines.
Responsibilities
Conduct thermal analysis on advanced two phase fluids, thermal and fluid management systems being developed for the aerospace and transportation industries.
Conduct thermal analysis of spacecraft components and electronics.
Support orbital heating analysis.
Support investigations to predict performance of rocket engines that use advanced cryogenic propellants.
Support integration of advanced cryogenic technologies into aerospace flight and ground support systems.
Requirements
Bachelor’s degree in Engineering or Physics or related technical discipline
Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science in Engineering
Bachelor's Degree or Equivalent
Nice to have: Active U.S. Top Secret/SCI Security Clearance
Nice to have: Experience within aerospace or related industry or with space electronics
Nice to have: Experience leading teams on complex projects
Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Compensation
Summary pay range: $146,200 - $197,800
Responsibilities
Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Active U.S. Top Secret/SCI Security Clearance
Nice to have: Experience within aerospace or related industry or with space electronics
Nice to have: 3+ years of experience leading teams on complex projects
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer
Design, analyze, and support space electronics packaging and mechanical products, including structural, thermal, and vibration analysis, PCB layout, and integration with satellite systems.
Compensation
Summary Pay Range (Associate - Level 2): $98,600- $133,400
Summary Pay Range (Mid-Level - Level 3): $119,850- $162,150
Responsibilities
Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Mid-Level (Level 3): 5+ years of related work experience or an equivalent combination of technical education and experience
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Associate)
Design and analyze space electronics packaging and mechanical products, performing structural, thermal, and vibration analysis, and collaborating with cross‑disciplinary teams.
Compensation
Summary Pay Range: $98,600- $133,400
Responsibilities
Coordinate with multi‑discipline groups to develop and understand requirements and develop high‑level and detailed designs consistent with those requirements
Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Perform detailed structural and thermal analysis using hand calculations and analysis tools
Document structural analyses and data to show compliance with Boeing, customer and regulatory requirements
Collaborate with Electrical Engineering team to perform sizing and placement studies and layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Active U.S. Top Secret/SCI Security Clearance
Nice to have: Experience within aerospace or related industry or with space electronics
Nice to have: Experience leading teams on complex projects
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Subject Matter Expert)
Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Compensation
Summary pay range: $146,200 - $197,800
Responsibilities
Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Active U.S. Top Secret/SCI Security Clearance
Nice to have: Experience within aerospace or related industry or with space electronics
Nice to have: Experience with ANSYS analysis, Creo CAD, SolidWorks, Finite Element Analysis (FEA), Siemens NX Nastran, MSC Patran, COMSOL Multiphysics
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer
Design and analyze space electronics packaging and mechanical components for satellite missions, performing structural, thermal, and vibration analysis, and collaborating with multi-discipline teams.
Compensation
Summary Pay Range (Associate - Level 2): $98,600- $133,400
Summary Pay Range (Mid-Level - Level 3): $119,850- $162,150
Responsibilities
Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Mid-Level (Level 3): 5+ years of related work experience or an equivalent combination of technical education and experience
Thermal AnalystSierra Lobo, Inc. · Milan, US
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Associate)Boeing · El Segundo, US
Sr. Manager, Electrical Engineering (Hardware)L3HHCM20 · Greenville, US