Lead the technical direction, architecture, and development of aircraft avionics thermal management systems.
Compensation
Pay within range listed + Bonus + Benefits + Equity
Responsibilities
Own thermal architecture, analysis, and design strategy for unmanned aerial vehicle avionics and aircraft-level thermal/fluid systems across programs.
Lead cross-functional trade studies and technical decisions, balancing thermal performance with power, weight, volume, reliability, manufacturability, and aircraft integration constraints.
Develop and validate analytical, numerical, and computational models for heat transfer and fluid flow using hand calculations and CFD tools such as FloEFD, and establish modeling standards and best practices.
Define verification and validation strategies, guiding test planning, instrumentation, and data analysis to correlate models with experimental results and resolve critical performance risks.
Serve as a technical authority in executive-level briefings, design reviews, and customer discussions, communicating complex findings and driving alignment on technical direction.
Requirements
B.S. in Mechanical Engineering, Aerospace Engineering, or related discipline
Nice to have: M.S. or Ph.D. in a relevant engineering discipline
Nice to have: high altitude aircraft avionics cooling
Nice to have: thermal architecture within aircraft integration constraints
Nice to have: thermal and fluid system test strategies
Lead planning, coordination, and integration of GN&C hardware for Blue Ring spacecraft, develop hardware, firmware and software solutions, support verification and testing, collaborate on software-in-the-loop and hardware-in-the-loop testing.
Compensation
Base Pay Range for: WA applicants is $156,802.00 - $219,522.45
Responsibilities
Lead planning and coordination of resources for procurement, acceptance and integration of GNC components
Develop hardware, firmware and software product solutions for future vehicle designs
Provide input on state-of-the-art hardware and firmware technologies
Support verification and testing of GN&C components
Collaborate on software-in-the-loop and hardware-in-the-loop testing, on-vehicle functional testing and flight-testing
Requirements
B.S. in Aerospace, Electrical, Mechanical, Physics, Systems Engineering or related technical subject area
Assembler for Boyd Thermal by Eaton, responsible for assembling parts per prints, inspecting, bonding, and testing components in a manufacturing environment.
Responsibilities
Assemble parts per prints and process instructions using necessary tooling
Perform basic math calculations and interpret basic blueprints
Conduct first piece inspection using visual or dimensional specifications
Perform accurate wanding and record keeping tasks
Apply bonding, pads, springs, pins, fans and other hardware per print using fixtures, tooling, hand and power tools
Develop and validate test methods for advanced heat transfer systems, collaborating with scientific, engineering, and global test teams to support new product development.
Locations (2)
Cleveland, Ohio, United States
Wilmington, Delaware, United States
Responsibilities
Design and develop test methods to evaluate the thermal, mechanical, electrical, rheological, and reliability performance of heat transfer technologies.
Establish, optimize, and validate test protocols using equipment such as thermal test vehicles, thermal analyzers, mechanical compression systems, rheometers, and environmental chambers.
Develop and implement automated test sequences and instrument interfaces to improve testing throughput, repeatability, and data integrity.
Design and validate prototype fixtures that reproduce customer application conditions.
Write technical reports on test development and test results.
Lead failure analysis of customer returns, systems and replaced parts from intake through documented closure. Develop controlled reproduction tests to isolate root cause across hardware, firmware, process and environment.
Responsibilities
Lead failure analysis of customer returns, systems and replaced parts from intake through documented closure.
Develop controlled reproduction tests to isolate root cause across hardware, firmware, process and environment.
Collaborate with PQE, suppliers, R&D and manufacturing to drive containment and closed-loop corrective actions.
Build risk analysis from historical data, lot traceability, serial ranges and field population exposure.
Translate real customer issues into improvements in supply quality and manufacturing process.
Requirements
BSEE
MSEE
Nice to have: MSEE
Nice to have: Engineering lab experience
Nice to have: High-Speed Digital Interface and Photoelectric test system and/or application knowledge
Electronics Technician responsible for assembling, testing, troubleshooting, repairing, and maintaining electronic components, circuit boards, and systems.
Responsibilities
Assemble, test, troubleshoot, repair, and maintain electronic components, circuit boards, and systems
Read and interpret schematics, wiring diagrams, blueprints, and engineering documentation
Perform hardware testing using oscilloscopes, power supplies, AC/DC loads and sources, signal generators, data acquisition systems, and other laboratory equipment
Conduct thermal and environmental testing, including operation of environmental chambers
Support EMI/EMC testing and apply applicable test methods and best practices
Requirements
Associates degree in electrical or engineering field required
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