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Serve as the lead integrator for complex 3DHi and 2.5D technology development programs
Define and integrate end-to-end process flows for chiplet-based 2.5D and 3DHi solutions
Own integration trade-off analysis across electrical performance, power delivery, signal integrity, thermal management, mechanical stress, warpage, reliability, yield, cost, and manufacturability
Define test-site requirements and lead development of test structures, interposer and package vehicles, daisy chains, reliability structures, and electrical test methodologies
Establish process-control, in line inspection, metrology, defectivity, known-good-die, assembly, and qualification strategies

Requirements

Bachelor’s degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field
Nice to have: Advanced degree in a relevant engineering or science discipline
Nice to have: Experience in Singapore’s semiconductor ecosystem
Nice to have: Working knowledge of 2.5D/3D design enablement and co-design considerations
Nice to have: Proven leadership in complex technology programmes

Skills

3D heterogeneous integration (3DHi)

MTBE Process Senior Technician

SOITEC-en · Posted Nov 4, 2026

Open

Singapore
Senior

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Monitor, analyze and make decisions on MTBE tools, perform metrology tuning, support process engineering tasks, and present daily process issues.

Responsibilities

Monitor and analyze MTBE tools
Dispose of out-of-control products per SOP
Compile and present daily process materials
Carry out process engineering tasks
Perform basic metrology tool tuning

Skills

SPC Metrology Defectivity Thickness Geometry Sorting Packaging Characterization lab Data collection Analysis PC skills Presentation skills

MTBE Process Technician

SOITEC-en · Posted Nov 4, 2026

Open

Singapore

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Monitor, analyze and make decisions on MTBE tools that are out of control for established SPC rules for both process and defect related issues.

Responsibilities

Monitor, analyze and make decisions on how to address MTBE tools that are out of control for established SPC rules for both process and defect related issues.
Use SOP to dispose of products that were out of control for established SPC rules for both process and defect related issues.
Perform daily compilation of presentation materials on daily process and tools issues and present in Passdown meeting.
Carry out and complete process engineering tasks assigned by process engineers which directly contributed to process improvement and flexibility improvement.
Perform basic metrology tool tuning.

Skills

SPC metrology defectivity thickness geometry sorting packaging characterization lab PC skills presentation skills data collection analysis teamwork multi-tasking project leading

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Field Application Engineer

ASML · Posted Nov 3, 2026

Open

Chengdu, China

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Provide technical support, develop and roll out new products, conduct analysis, train customers and colleagues, and share knowledge in a semiconductor manufacturing environment.

Responsibilities

Escalation support
Contributes to service order actions and problem description clarification
Creates basic diagnostics requirements for one specific use case
Executes standard tasks and can lead part of the roll out of a new product or service
Creates knowledge sharing material for future reference

Requirements

MSc or PhD in technical field

Skills

IC manufacturing lithography patterning overlay imaging focus metrology defectivity diagnostics NPI analysis integration training delivery data analysis default toolsets

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Senior Director Process Engineer

Senior Director Process Engineer

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Field Application Engineer

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Senior Integration Lead - Advanced Packaging 3DHi and 2.5D

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MTBE Process Senior Technician

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MTBE Process Technician

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Field Application Engineer

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Defectivity jobs

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Benefits

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