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1–3 jobs· newest first

Sr. Systems Design Engineer
Advanced Micro Devices, Inc · Markham, Canada
On-site · Senior
MEMS Semiconductor & Assembly Process Engineer
Seek Thermal, Inc · Goleta, US
Hardware Engineer
Altair Semiconductor · Israel

+10K new in the last hour

Sr. Systems Design Engineer

Advanced Micro Devices, Inc · Posted Nov 6, 2026

Markham, Ontario, Canada
On-site
Senior

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Lead platform deployment, availability, and stability for data center CPU/GPU systems, driving system-level debugging and continuous improvement in a fast-paced on-site environment.

Responsibilities

Manage platform deployment, availability, and stability for data center CPU/GPU systems
Lead system-level debugging efforts involving hardware, firmware, Linux, networking, power, and thermal behavior
Develop structured debug strategies, validation flows, and failure-analysis methodologies
Installation, configuration of various OS Distros from console, setup Network gear, perform and validate Network configurations
Provide logs and statistics that will help in further debug of issues

Requirements

Bachelor's or Masters degree in electrical or computer engineering/ Computer science

Skills

Systems design Hardware debugging Firmware debugging Linux Networking Power management Thermal management Clustering BIOS BMC OS distribution configuration Network gear configuration Ticketing system Agile methodology JIRA Confluence Test automation Failure-analysis PCIe Gen5 Hardware lab equipment FPGA CPLD Storage solutions Cobbler OpenStack Foreman

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MEMS Semiconductor & Assembly Process Engineer

Seek Thermal, Inc · Posted Nov 5, 2026

Goleta, California, United States
5+ years

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Responsible for MEMS sensor die fabrication and assembly processes from wafer fabrication through wafer-level packaged and tested die.

Responsibilities

Own and sustain MEMS fabrication processes to yield, Cpk, and cost targets
Develop and qualify assembly and packaging processes
Characterize bond interfaces and package hermeticity
Design and run DOEs; use SPC and statistical analysis to identify drivers of yield loss
Manage outsourced process steps at external suppliers

Requirements

BS in Electrical/Mechanical Engineering, Materials Science, Physics, or related field; MS preferred
Nice to have: microbolometers
Nice to have: wafer-level packaging
Nice to have: anti-reflective coatings
Nice to have: wafer defect identification

Skills

MEMS fabrication processes thin-film deposition lithography metallization etch release

Hardware Engineer

Altair Semiconductor · Posted Nov 4, 2026

Israel
5+ years

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Hardware engineer owning the ATE and test hardware for cellular IoT chipset programs

Responsibilities

Own ATE/test hardware end to end — DUT/load boards, multi-site boards, characterization setups — through schematic, layout, fabrication, bring-up, and correlation.
Drive test-system debug to root cause (signal integrity, board-tester interface, yield/correlation) and support device characterization and screening.
Debug on-site at partner and test-house locations, including international travel.
Design RF/analog front-end circuitry for test and evaluation: RF chains, matching networks, switch topologies, and interfaces.
Design multilayer PCBs (incl. high-layer-count with blind/buried vias) in Cadence Allegro/OrCAD, with clean, manufacturable fab/assembly outputs (Gerber/ODB++, DFM, stackup/impedance).

Requirements

B.Sc. in Electrical/Electronic Engineering
Nice to have: specific ATE/tester family
Nice to have: multi-site DUT board design
Nice to have: Cellular modem integration (LTE-M / NB-IoT)
Nice to have: C

Skills

board-level hardware design schematic capture multilayer PCB design

wafer-level hermetic vacuum sealing

failure-analysis

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Cadence Allegro/OrCAD

ATE/test hardware design

debugging ATE/test hardware

failure-analysis

RF/analog fundamentals

RF lab instrumentation

ATE/test systems

RF lab instrumentation (VNA, spectrum analyzer, scope)

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