Developing and executing III-V semiconductor processes (InP/GaAs) and leading silicon photonics post-processing development within a cleanroom environment.
Responsibilities
Developing and executing III-V semiconductor processes (InP/GaAs), covering both front-end and back-end of line operations within a cleanroom environment
Leading silicon photonics post-processing development and execution, including BEOL steps such as lithography, metallization, passivation, and bondpad opening
Collaborating closely with cross-functional teams to successfully integrate newly developed processes into standard process flows
Documenting process development activities, analysing results, and continuously driving improvements to ensure process stability and performance
Contributing actively to team discussions and technical reviews, sharing knowledge and supporting the broader goals of the engineering group
Requirements
Master's degree or PhD in Applied Physics, Electrical Engineering, or a related discipline
A strategic leadership role focused on advanced electronics and PCB value chains, requiring strategic partnership building and frequent travel across Asia.
Responsibilities
Understand PCB value chains, technologies, market trends, strengths, weaknesses, opportunities, and threats related to the business.
Build strategic partnerships and expand customer base through various marketing activities.
Collaborate with cross-functional teams to develop and implement growth strategies.
Identify business opportunities and risks, and work with functional teams to develop and drive appropriate actions.
Requirements
Bachelor’s degree or above in engineering or science
We are seeking a Senior Process Engineer (Substrate) to support the development of Syenta's advanced packaging toolset. In this hands-on role, you will develop critical components of the toolset, focusing on process development of (1) Photo Imageable Dielectric (PID) coating and patterning of precise, fine-line circuitry, and (2) Wafer Level Processing, including photolithography, etching, thin film deposition, wet processing, and metrology verification.
Compensation
Early-stage equity opportunities, Potential 401(k) and other benefits
Responsibilities
Develop and optimize Photo Imageable Dielectric (PID) and light-sensitive insulating material processes (e.g., PV-FX2 HR200) for advanced semiconductor packaging and fine-line circuit patterning
Drive multi-layer build-up process development and support translation of prototype processes into scalable, high-yield manufacturing solutions for advanced packaging
Execute microfabrication processes including photolithography, etching, thin film deposition, wet processing, and metrology verification (e.g., developing tool- and material-specific recipes)
Troubleshoot microfabrication defects
Collaborate closely with Sydney team
Requirements
Bachelor's degree in physics, Chemistry, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
Nice to have: Master's or PhD in Physics, Chemistry, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field
Nice to have: Experience in the semiconductor industry
Mid-level Process Engineer role focused on semiconductor microfabrication to develop and manufacture critical parts of the localized electrodeposition process.
Responsibilities
Follow, maintain and develop process flows for the fabrication of Syenta’s LEM stamps
Take ownership of assigned process modules from definition through to stable, repeatable execution
Characterise and optimise unit processes (e.g., lithography, deposition, etch, plating)
Execute structured experiments and data analysis to improve yield, uniformity and throughput
Document processes clearly through run sheets, SOPs and technical reports
Requirements
Bachelor’s degree or equivalent in Nanotechnology, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science, or related field
Own the quality interface with assigned wafer foundries and act as the primary contact for supplier quality topics across development, qualification, ramp-up, and series production.
Responsibilities
Define, monitor, and review supplier quality KPIs, scorecards, process capability, yield performance, reliability performance, audit findings, and improvement actions.
Conduct regular supplier quality and business reviews to align expectations, identify risks, and drive sustainable corrective and preventive actions.
Assess and manage supplier risks relating to process stability, capacity, quality systems, sub-tier control, and manufacturing changes.
Plan and conduct supplier system, process, and technology audits at wafer foundries, including follow-up and closure of findings.
Evaluate compliance with IATF 16949, VDA 6.3, ISO 9001, automotive core tools, customer-specific requirements, and internal quality requirements, as applicable.
Requirements
Bachelor’s degree in electrical, Electronics, Microelectronics, Materials, Chemical Engineering, Physics, or a related technical discipline.
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