drive next-generation packaging integration and technology development for future products.
Responsibilities
lead the definition, development, and qualification of cutting-edge 2.5D and 3D packaging technologies
work cross-functionally with silicon design, physical design, SI/PI, thermal, and manufacturing teams to guide technologies from early architecture exploration through qualification and high-volume manufacturing
As the Technical Fellow, Advanced Packaging Integration, you’ll be a central figure in that mission, a recognized technical authority who bridges advanced packaging, processor architecture, and system-level performance. This is a rare opportunity to shape the technical direction of two of TechInsights’ most dynamic product areas: Advanced Packaging and High Performance Computing.
Compensation
Expected salary range: $175,000 - $195,000 CAD
Responsibilities
Serve as TechInsights’ subject matter expert across advanced packaging, HPC processors, networking ASICs, and memory integration
Provide authoritative insights on leading-edge and emerging packaging and system integration technologies
Shape and maintain TechInsights’ Advanced Packaging and HPC technology roadmaps
Identify and prioritize parts and systems for analysis across processors, accelerators, and networking platforms
Help drive product evolution toward system-level analysis, including server performance testing, interconnect and power delivery characterization, and thermal benchmarking
Lead definition, development, and qualification of advanced 2.5D and 3D packaging technologies for future Apple products.
Responsibilities
Define and develop cutting‑edge 2.5D/3D packaging architectures
Qualify and scale packaging technologies for high‑volume manufacturing
Collaborate with silicon design, physical design, SI/PI, thermal, and manufacturing teams
Guide technologies from early architecture exploration through qualification
Requirements
Bachelor’s degree required
Degree: B.S., M.S., or Ph.D. in Physics, Materials Science, Electrical Engineering, Mechanical Engineering, Computer Engineering, or a related technical discipline
Lead ASIC development activities across requirements, solution alternatives, engagement with design and integration partners, and execution planning, including testing, qualification, and system integration.
Act as the technical interface to ASIC design partners, coordinating requirements, design reviews, technical decisions, risks, and deliverables.
Lead (ASIC) Development & Integration Engineer (m/f/d)
Lead the development, testing, and integration of advanced ASIC-based electronics for high-performance applications.
Locations (4)
Heimstetten, Bavaria, Germany
Munich, Bavaria, Germany
Delft, South Holland, Netherlands
Nijmegen, Gelderland, Netherlands
Compensation
€70.400,00 - €96.800,00
Responsibilities
Lead ASIC development activities across requirements, solution alternatives, engagement with design and integration partners, and execution planning, including testing, qualification, and system integration.
Define and drive ASIC test, characterization, silicon bring-up, and debugging activities.
Lead integration of ASICs into advanced electronic and MEMS modules, including flip-chip assembly, interposers, and associated electrical and mechanical interfaces.
Define test hardware, setups, automated measurements, and data analysis for device and module characterization.
Requirements
Degree in electrical engineering, electronics, physics, or a related field.
Act as the technical interface to ASIC design partners, coordinating requirements, design reviews, technical decisions, risks, and deliverables.
Define and drive ASIC test, characterization, silicon bring-up, and debugging activities.
Lead integration of ASICs into advanced electronic and MEMS modules, including flip-chip assembly, interposers, and associated electrical and mechanical interfaces.
Define test hardware, setups, automated measurements, and data analysis for device and module characterization.
Requirements
Degree in electrical engineering, electronics, physics, or a related field
Advanced Packaging Development EngineerNewApple · US
Technical Fellow, Advanced Packaging IntegrationNewTechInsights · Ottawa, Canada