Supports customers in the application of Onto Innovation’s automatic optical inspection (AOI) 2D and 3D products, including troubleshooting process integration issues, evaluating product performance, and training customer staff.
Compensation
Base Salary Range: $86,400.00 - $129,600.00, offered in good faith and based on experience, location, and qualifications. Additional Rewards: Annual bonus opportunities and potential long-term incentives tied to both company and individual success.
Responsibilities
Deliver technical presentation and perform system demonstration/sample inspection/measurement for customers.
Provide both on-site and remote applications support to customers.
Assist customers in solving problems related to the application of inspection tools to their manufacturing processes.
Supports the Applications Lab with input to customer Test Plans and provides execution support when required.
Interface with external customers and internal departments to best determine equipment specifications.
Transform deep industry expertise in photonics manufacturing into next-generation equipment concepts for ZEISS, identifying manufacturing bottlenecks and initiating breakthrough architectures for photonic integration in semiconductor manufacturing.
Responsibilities
Transform deep industry expertise in photonics manufacturing into next-generation equipment concepts for ZEISS.
Identify manufacturing bottlenecks and unmet equipment needs in photonics ramp-up and scaling.
Initiate development of breakthrough concepts and architectures for ZEISS equipment solutions that enable photonic integration in semiconductor manufacturing.
Own pre-development initiatives.
Work closely with customers, foundries, OSATs, photonics packaging fabs, R&D institutes and internal ZEISS R&D teams to align technology roadmaps with real industrial manufacturing needs.
Requirements
Graduate degree in electrical engineering, semiconductor technology, photonics, physics or a closely related field
Nice to have: Professional network in the photonics and semiconductor ecosystem
Lead Combined Cycle Plant Process & Performance Engineer responsible for heat balance diagrams, functional specifications, performance predictions, and integration concepts for combined cycle plants worldwide.
Compensation
For candidates applying to a U.S. based position, the pay range for this position is between $ 119,072 and $178,608. The Company pays a geographic differential of 110%, 120% or 130% of salary in certain areas. The specific pay offered may be influenced by a variety of factors, including the candidate’s experience, education, and skill set.
Responsibilities
Develop and execute configurations for tendering and execution projects
Lead completion of heat balances and produce correction curves
Manage relationships with product application engineering
System engineering for core combined cycle plant equipment
Deliver heat & mass balance diagrams and performance correction curves
Requirements
Bachelor's degree from an accredited university or college
Nice to have: Basic technical understanding of Gas Turbine, Combined Cycle, Steam Turbine products
Nice to have: Design creativity and problem-solving capability
Nice to have: Understanding of plant operational concepts
Lead Combined Cycle Plant Process & Performance Engineer responsible for heat balance diagrams, performance predictions, and integration concepts for combined cycle plants worldwide.
Responsibilities
Provide combined cycle modeling guidance and leadership to develop and execute configurations with winning performance for ITO, OTR, and NPI initiatives
Lead the completion of heat balances and produce correction curves to support timely bid execution
Manage a close working relationship with product application engineering for gas turbine, steam turbine and HRSG
System engineering for core combined cycle plant equipment, including process calculations and component design
Deliver heat & mass balance diagrams and performance correction curves for project execution and development
Requirements
Bachelor's degree from an accredited university or college (or a high school diploma with relevant experience)
Nice to have: Advanced experience in Engineering/Technology & Process Engineering
Nice to have: Design creativity
Nice to have: Problem-solving capability
Nice to have: Understanding of process flow diagrams
Lead and manage finance-focused strategic initiatives within Agoda’s New Business Initiatives team, driving process integration, automation, and cross-functional collaboration to support sustainable growth.
Responsibilities
Project manage and implement company-wide strategic initiatives
Analyze implications of new initiatives on finance functions
Coordinate with stakeholders to gather requirements and optimize processes
Ensure timely progress and achievement of project milestones
Assist with UAT testing and post-launch issue resolution
Requirements
Undergraduate Degree in Business Administration, Finance, Accounting or related field
Nice to have: Tech industry / e-commerce background
Nice to have: Finance operations
Nice to have: Business analysis
Nice to have: Fast-paced industry or consulting firm experience
Lead and drive innovation and technology development for high voltage power semiconductor device platforms, defining roadmaps, managing complex projects, and mentoring engineering teams.
Compensation
For this position, we offer a gross annual salary of approximately €120,000 to €160,000.
Responsibilities
Define technology roadmaps and long-term strategies
Identify emerging technologies, market trends, and competitive opportunities
Assess and influence alignment of device technologies with customer and application requirements
Generate intellectual property through patents and technical publications
Serve as the company's technical expert for critical device and technology challenges
Lead process integration engineering within a semiconductor manufacturing environment, managing a team of integration engineers and driving cross‑functional alignment to achieve product performance, yield, quality, and manufacturability targets.
Compensation
$138,900.00 - $182,280.00
Responsibilities
Own and drive end‑to‑end process integration across probe card manufacturing flows
Define, maintain, and continuously improve integrated process flows
Identify integration risks, process interactions, and trade‑offs impacting yield, performance, and manufacturability
Lead integration‑level yield improvement initiatives using data‑driven analysis
Drive root cause identification and resolution of complex yield excursions and defect mechanisms
Support the 300mm semiconductor technology development integration team by contributing to the process integration of silicon photonic devices across development, customer engagement, qualification, and production readiness.
Locations (2)
New York, New York, United States
Malta
Compensation
$20.00 - $40.00
Responsibilities
Collaborate with device, process module, packaging, test, and integration teams to develop and drive silicon photonics input/output solutions.
Learn integration module ownership while supporting the development and qualification of silicon photonics input/output processes and structures.
Assist with analysis of process, device, and yield data to identify trends, document results, and support technical problem solving.
Support project execution through experiment tracking, status communication, and preparation of technical summaries for cross-functional stakeholders.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
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